Huawei HiSilicon Kirin 710 3DMark Benchmark score
Huawei HiSilicon Kirin 710 has an 3DMark benchmark score of around 544 points, which ranks it above its competitors like the Qualcomm Snapdragon 678 (which received 483 marks in this test). It was used for the Huawei Honor 10 Lite 3/64Gb 1 and the Huawei Honor 20 Lite smartphones. The Huawei HiSilicon Kirin 710 is a powerful processor with great specs, that boasts 8 cores, 2.2 GHz clock rate, Mali-G51 MP GPU, and a 6 Gb memory support. The CPU is based on the 4 x 2.2 GHz ARM Cortex-A73 + 4 x 1.7 GHz ARM Cortex-A53 architecture, while the chip is made with 12 nm technology and has a 5 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 710?
Specification
Processor name | Huawei HiSilicon Kirin 710 |
---|---|
Release Date | 7/19/2018 |
CPU Architecture | 4 x 2.2 GHz ARM Cortex-A73 + 4 x 1.7 GHz ARM Cortex-A53 |
Number of Cores | 8 |
Clock Rate | 2.2 GHz |
Chip technology | 12 nm |
GPU | Mali-G51 MP |
The highest TDP | 5 |
Memory | 6 Gb |
Features | Huawei HiSilicon modem |
Upload Speed (up to) | 150 Mbps |