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Qualcomm Snapdragon 730 3DMark Benchmark score

Qualcomm Snapdragon 730 has an 3DMark benchmark score of around 668 points, which ranks it above its competitors like the Samsung Exynos 8890 (which received 658 marks in this test). It was used for the Oppo Reno 2 and the Xiaomi Mi 9 T 6/128Gb smartphones. The Qualcomm Snapdragon 730 is a powerful processor with great specs, that boasts 8 cores, 2.2 GHz clock rate, Adreno 618 GPU, and a 8 Gb memory support. The CPU is based on the 2x 2.2 GHz Cortex-A76 + 6x 1.8 GHz Cortex-A55 architecture, while the chip is made with 8 nm technology and has a 5 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 730 3DMark Benchmark score
Qualcomm Snapdragon 730 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 730?

CPU3DMark benchmark scores
MediaTek Helio G88 719
MediaTek Helio G85 714
Qualcomm Snapdragon 820 711
Qualcomm Snapdragon 670 691
MediaTek Helio G80 684
Qualcomm Snapdragon 730 668
Samsung Exynos 8890 658
Qualcomm Snapdragon 712 655
MediaTek Helio G91 607
MediaTek Helio G72 601
MediaTek Helio G70 593

Specification

Processor nameQualcomm Snapdragon 730
Release Date9/4/2019
CPU Architecture2x 2.2 GHz Cortex-A76 + 6x 1.8 GHz Cortex-A55
Number of Cores8
Clock Rate2.2 GHz
Chip technology8 nm
GPUAdreno 618
The highest TDP5
Memory8 Gb
FeaturesSnapdragon X15
Upload Speed (up to)150 Mbps