Samsung Exynos 8895 3DMark Benchmark score
Samsung Exynos 8895 has an 3DMark benchmark score of around 872 points, which ranks it above its competitors like the Huawei HiSilicon Kirin 970 (which received 834 marks in this test). It was used for the Meizu M15 Plus and the Meizu 15 Plus 6/128Gb smartphones. The Samsung Exynos 8895 is a powerful processor with great specs, that boasts 8 cores, 2.3 GHz clock rate, Mali-G71 MP GPU, and a 4 Gb memory support. The CPU is based on the 4 x 2.3 GHz Exynos M2 Mongoose + 4 x 1.7 GHz ARM Cortex A53 architecture, while the chip is made with 10 nm technology and has a 5 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Samsung Exynos 8895?
Specification
Processor name | Samsung Exynos 8895 |
---|---|
Release Date | 2/23/2017 |
CPU Architecture | 4 x 2.3 GHz Exynos M2 Mongoose + 4 x 1.7 GHz ARM Cortex A53 |
Number of Cores | 8 |
Clock Rate | 2.3 GHz |
Chip technology | 10 nm |
GPU | Mali-G71 MP |
The highest TDP | 5 |
Memory | 4 Gb |
Features | Samsung modem |
Upload Speed (up to) | 150 Mbps |