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Samsung Exynos 8895 3DMark Benchmark score

Samsung Exynos 8895 has an 3DMark benchmark score of around 872 points, which ranks it above its competitors like the Huawei HiSilicon Kirin 970 (which received 834 marks in this test). It was used for the Meizu M15 Plus and the Meizu 15 Plus 6/128Gb smartphones. The Samsung Exynos 8895 is a powerful processor with great specs, that boasts 8 cores, 2.3 GHz clock rate, Mali-G71 MP GPU, and a 4 Gb memory support. The CPU is based on the 4 x 2.3 GHz Exynos M2 Mongoose + 4 x 1.7 GHz ARM Cortex A53 architecture, while the chip is made with 10 nm technology and has a 5 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Samsung Exynos 8895 3DMark Benchmark score
Samsung Exynos 8895 3DMark Benchmark score

What is the 3DMark Benchmark score of Samsung Exynos 8895?

CPU3DMark benchmark scores
Qualcomm Snapdragon 835 1069
Qualcomm Snapdragon 690 1039
UNISOC T750 1011
Qualcomm Snapdragon 480+ 989
Qualcomm Snapdragon 480 987
Samsung Exynos 8895 872
Huawei HiSilicon Kirin 970 834
Qualcomm Snapdragon 720G 783
Samsung Exynos 9611 778
Qualcomm Snapdragon 730G 748
Qualcomm Snapdragon 821 745

Specification

Processor nameSamsung Exynos 8895
Release Date2/23/2017
CPU Architecture4 x 2.3 GHz Exynos M2 Mongoose + 4 x 1.7 GHz ARM Cortex A53
Number of Cores8
Clock Rate2.3 GHz
Chip technology10 nm
GPUMali-G71 MP
The highest TDP5
Memory4 Gb
FeaturesSamsung modem
Upload Speed (up to)150 Mbps