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Reviews

MediaTek Dimensity 8300 Geekbench Benchmark score

MediaTek Dimensity 8300 has been tested at 4814 / 1501 points on Geekbench benchmark. That puts it ahead of its competitors, such as the Qualcomm Snapdragon 8 Gen 2, which received a score around 4506 / 1387 points in this test. We've seen it present in phones like the Xiaomi CIVI 4 and Xiaomi Poco X6 Pro. The main specification is 1x 3.35GHz ARM Cortex-A715 + 3x 3.2GHz ARM Cortex-A715 + 4x 2.2GHz Cortex-A510 architecture, it supports memory up to 24 Gb, made with use 4 nm technology, and has 10 TDP. MediaTek Dimensity 8300 has 8 cores, which means it's ready to multitask and get things done quickly. The GPU is Mali-G615 MP and the CPU has a clock rate up to 3.35 GHz. You'll also get a built-in modem with a connection speed of up to 7900 Mbps. You can compare this chipset rank with others in the datasheet below.

MediaTek Dimensity 8300 Geekbench Benchmark score
MediaTek Dimensity 8300 Geekbench Benchmark score
MediaTek Dimensity 8300 Geekbench Benchmark score

What is the Geekbench Benchmark score of MediaTek Dimensity 8300?

CPUGeekbench benchmark scores
MediaTek Dimensity 9200+ 5613/2102
Qualcomm Snapdragon 8s Gen 3 5369/1999
Qualcomm Snapdragon 8+ Gen 2 5217/1778
Apple A16 Bionic 5052/1903
Apple A15 Bionic 4874/1769
MediaTek Dimensity 8300 4814/1501
Qualcomm Snapdragon 8 Gen 2 4506/1387
MediaTek Dimensity 9200 4461/1422
HiSilicon Kirin 9010 4331/1422
MediaTek Dimensity 9000+ 4328/1296
Qualcomm Snapdragon 8+ Gen 1 4328/1298

Specification

Processor nameMediaTek Dimensity 8300
Release Date11/21/2023
CPU Architecture1x 3.35GHz ARM Cortex-A715 + 3x 3.2GHz ARM Cortex-A715 + 4x 2.2GHz Cortex-A510
Number of Cores8
Clock Rate3.35 GHz
Chip technology4 nm
GPUMali-G615 MP
The highest TDP10
Memory24 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)7900 Mbps