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HiSilicon Kirin 9010 3DMark Benchmark score

HiSilicon Kirin 9010 has an 3DMark benchmark score of around 6453 points, which ranks it above its competitors like the Google Tensor G2 (which received 6398 marks in this test). It was used for the Huawei Pura 70 Ultra and the Huawei Pura 70 Ultra smartphones. The HiSilicon Kirin 9010 is a powerful processor with great specs, that boasts 12 cores, 2.3 GHz clock rate, Maleoon-910 MP GPU, and a 24 Gb memory support. The CPU is based on the 2 x TaiShan V121 2.3GHz + 4 x TaiShan V121 1.55GHz + 6 x Cortex-A510 2.18GHz architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 4600 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

HiSilicon Kirin 9010 3DMark Benchmark score
HiSilicon Kirin 9010 3DMark Benchmark score

What is the 3DMark Benchmark score of HiSilicon Kirin 9010?

CPU3DMark benchmark scores
Apple A14 Bionic 7592
Apple A13 Bionic 7578
MediaTek Dimensity 8300 7076
Samsung Exynos 2200 6902
Google Tensor G3 6657
HiSilicon Kirin 9010 6453
Google Tensor G2 6398
MediaTek Dimensity 8250 6311
Qualcomm Snapdragon 7 Gen 3 6255
Google Tensor 6220
MediaTek Dimensity 8100 6213

Specification

Processor nameHiSilicon Kirin 9010
Release Date04/10/2024
CPU Architecture2 x TaiShan V121 2.3GHz + 4 x TaiShan V121 1.55GHz + 6 x Cortex-A510 2.18GHz
Number of Cores12
Clock Rate2.3 GHz
Chip technology5 nm
GPUMaleoon-910 MP
The highest TDP10
Memory24 Gb
FeaturesBalong 5000
Upload Speed (up to)4600 Mbps