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MediaTek Dimensity 8350 3DMark Benchmark score

MediaTek Dimensity 8350 has an 3DMark benchmark score of around 9449 points, which ranks it above its competitors like the MediaTek Dimensity 9000+ (which received 8275 marks in this test). It was used for the Realme P3 Ultra 5G and the Motorola Edge 60 Pro smartphones. The MediaTek Dimensity 8350 is a powerful processor with great specs, that boasts 8 cores, 3.35 GHz clock rate, Mali-G615 MP GPU, and a 24 Gb memory support. The CPU is based on the 1x 3.35GHz ARM Cortex-A715 + 3x 3.2GHz ARM Cortex-A715 + 4x 2.2GHz Cortex-A510 architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 1000 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 8350 3DMark Benchmark score
MediaTek Dimensity 8350 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 8350?

CPU3DMark benchmark scores
Samsung Exynos 2400e 10317
MediaTek Dimensity 9200 10289
Qualcomm Snapdragon 7+ Gen 3 10228
Qualcomm Snapdragon 8 Gen 2 9870
Apple A15 Bionic 9558
MediaTek Dimensity 8350 9449
MediaTek Dimensity 9000+ 8275
Qualcomm Snapdragon 8+ Gen 1 8224
Qualcomm Snapdragon 8 Gen 1 8165
MediaTek Dimensity 9000 7894
Qualcomm Snapdragon 7+ Gen 2 7864

Specification

Processor nameMediaTek Dimensity 8350
Release Date11/21/2024
CPU Architecture1x 3.35GHz ARM Cortex-A715 + 3x 3.2GHz ARM Cortex-A715 + 4x 2.2GHz Cortex-A510
Number of Cores8
Clock Rate3.35 GHz
Chip technology4 nm
GPUMali-G615 MP
The highest TDP10
Memory24 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)1000 Mbps