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Huawei HiSilicon Kirin 930 3DMark benchmark score

Huawei HiSilicon Kirin 930 3DMark benchmark score
Huawei HiSilicon Kirin 930 3DMark benchmark score

Hvad er 3DMark Benchmark-score for Huawei HiSilicon Kirin 930?

CPU3DMark benchmarkscore
Qualcomm Snapdragon 8 Gen 4 19883
MediaTek Dimensity 9300+ 15004
MediaTek Dimensity 9300 14398
Qualcomm Snapdragon 8s Gen 3 13783
Qualcomm Snapdragon 8 Gen 3 13177
Apple A17 Pro 12658
Qualcomm Snapdragon 8+ Gen 2 11341
Apple A16 Bionic 11022
MediaTek Dimensity 9200+ 11012
MediaTek Dimensity 9200 10289
Qualcomm Snapdragon 7+ Gen 3 10228

Specifikationer

ModellHuawei HiSilicon Kirin 930
Udgivelses dato03/04/2015
CPU-arkitektur4 x ARM Cortex-A53 2 GHz + 4 x ARM Cortex-A53 1,5 GHz
Kerner8
Frekvens2 GHz
Processteknologi 28 nm
GPUMali T628MP
TDP5
Kapacitet6 Gb
FeaturesHuawei HiSilicon modem
Upload Speed50 Mbps