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Huawei HiSilicon Kirin 659 3DMark Benchmark score

Huawei HiSilicon Kirin 659 has an 3DMark benchmark score of around 122 points, which ranks it above its competitors like the Intel Atom Z3560 (which received 122 marks in this test). It was used for the Huawei Y9 and the Huawei X Honor V12 smartphones. The Huawei HiSilicon Kirin 659 is a powerful processor with great specs, that boasts 8 cores, 2.36 GHz clock rate, Mali T830MP GPU, and a 4 Gb memory support. The CPU is based on the 4 x ARM Cortex-A53 2,36 GHz + 4 x ARM Cortex-A53 1,7 GHz architecture, while the chip is made with 16 nm technology and has a 5 TDP. The built-in modem supports speeds up to 50 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Huawei HiSilicon Kirin 659 3DMark Benchmark score
Huawei HiSilicon Kirin 659 3DMark Benchmark score

What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 659?

CPU3DMark benchmark scores
MediaTek MT6750 136
Qualcomm Snapdragon 439 134
Intel Atom Z3580 130
Qualcomm Snapdragon 652 129
Qualcomm Snapdragon 435 124
Huawei HiSilicon Kirin 659 122
Intel Atom Z3560 122
Huawei HiSilicon Kirin 658 121
Huawei HiSilicon Kirin 925 119
MediaTek Helio G35 119
MediaTek Helio P22 119

Specification

Processor nameHuawei HiSilicon Kirin 659
Release Date03/17/2017
CPU Architecture4 x ARM Cortex-A53 2,36 GHz + 4 x ARM Cortex-A53 1,7 GHz
Number of Cores8
Clock Rate2.36 GHz
Chip technology16 nm
GPUMali T830MP
The highest TDP5
Memory4 Gb
FeaturesHuawei HiSilicon modem
Upload Speed (up to)50 Mbps