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MediaTek Dimensity 9000 3DMark Benchmark score

MediaTek Dimensity 9000 has an 3DMark benchmark score of around 7894 points, which ranks it above its competitors like the Qualcomm Snapdragon 7+ Gen 2 (which received 7864 marks in this test). It was used for the Tecno Phantom V Fold2 5G and the Samsung Galaxy S22 FE smartphones. The MediaTek Dimensity 9000 is a powerful processor with great specs, that boasts 8 cores, 3.05 GHz clock rate, Mali-G710 MC GPU, and a 16 Gb memory support. The CPU is based on the 1 x 3.05GHz Cortex-X2 +3 x 2.85GHz Cortex-A710 + 4 x 1.8GHz Cortex-A510 architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 316 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 9000 3DMark Benchmark score
MediaTek Dimensity 9000 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 9000?

CPU3DMark benchmark scores
Apple A15 Bionic 9558
MediaTek Dimensity 8350 9449
MediaTek Dimensity 9000+ 8275
Qualcomm Snapdragon 8+ Gen 1 8224
Qualcomm Snapdragon 8 Gen 1 8165
MediaTek Dimensity 9000 7894
Qualcomm Snapdragon 7+ Gen 2 7864
Apple A14 Bionic 7592
Apple A13 Bionic 7578
MediaTek Dimensity 8300 7076
Samsung Exynos 2200 6902

Specification

Processor nameMediaTek Dimensity 9000
Release Date11/20/2021
CPU Architecture1 x 3.05GHz Cortex-X2 +3 x 2.85GHz Cortex-A710 + 4 x 1.8GHz Cortex-A510
Number of Cores8
Clock Rate3.05 GHz
Chip technology4 nm
GPUMali-G710 MC
The highest TDP10
Memory16 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)316 Mbps