MediaTek Dimensity 9000 3DMark Benchmark score
MediaTek Dimensity 9000 has an 3DMark benchmark score of around 7894 points, which ranks it above its competitors like the Qualcomm Snapdragon 7+ Gen 2 (which received 7864 marks in this test). It was used for the Tecno Phantom V Fold2 5G and the Samsung Galaxy S22 FE smartphones. The MediaTek Dimensity 9000 is a powerful processor with great specs, that boasts 8 cores, 3.05 GHz clock rate, Mali-G710 MC GPU, and a 16 Gb memory support. The CPU is based on the 1 x 3.05GHz Cortex-X2 +3 x 2.85GHz Cortex-A710 + 4 x 1.8GHz Cortex-A510 architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 316 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of MediaTek Dimensity 9000?
Specification
| Processor name | MediaTek Dimensity 9000 |
|---|---|
| Release Date | 11/20/2021 |
| CPU Architecture | 1 x 3.05GHz Cortex-X2 +3 x 2.85GHz Cortex-A710 + 4 x 1.8GHz Cortex-A510 |
| Number of Cores | 8 |
| Clock Rate | 3.05 GHz |
| Chip technology | 4 nm |
| GPU | Mali-G710 MC |
| The highest TDP | 10 |
| Memory | 16 Gb |
| Features | MediaTek 5G modem |
| Upload Speed (up to) | 316 Mbps |