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MediaTek Dimensity 8300 3DMark Benchmark score

MediaTek Dimensity 8300 has an 3DMark benchmark score of around 7076 points, which ranks it above its competitors like the Samsung Exynos 2200 (which received 6902 marks in this test). It was used for the Xiaomi CIVI 4 and the Xiaomi Poco X6 Pro 5G 12 512GB smartphones. The MediaTek Dimensity 8300 is a powerful processor with great specs, that boasts 8 cores, 3.35 GHz clock rate, Mali-G615 MP GPU, and a 24 Gb memory support. The CPU is based on the 1x 3.35GHz ARM Cortex-A715 + 3x 3.2GHz ARM Cortex-A715 + 4x 2.2GHz Cortex-A510 architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 7900 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 8300 3DMark Benchmark score
MediaTek Dimensity 8300 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 8300?

CPU3DMark benchmark scores
Qualcomm Snapdragon 8 Gen 1 8165
MediaTek Dimensity 9000 7894
Qualcomm Snapdragon 7+ Gen 2 7864
Apple A14 Bionic 7592
Apple A13 Bionic 7578
MediaTek Dimensity 8300 7076
Samsung Exynos 2200 6902
Google Tensor G3 6657
HiSilicon Kirin 9010 6453
Google Tensor G2 6398
MediaTek Dimensity 8250 6311

Specification

Processor nameMediaTek Dimensity 8300
Release Date11/21/2023
CPU Architecture1x 3.35GHz ARM Cortex-A715 + 3x 3.2GHz ARM Cortex-A715 + 4x 2.2GHz Cortex-A510
Number of Cores8
Clock Rate3.35 GHz
Chip technology4 nm
GPUMali-G615 MP
The highest TDP10
Memory24 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)7900 Mbps