MediaTek Dimensity 8300 3DMark Benchmark score
MediaTek Dimensity 8300 has an 3DMark benchmark score of around 7076 points, which ranks it above its competitors like the Samsung Exynos 2200 (which received 6902 marks in this test). It was used for the Xiaomi CIVI 4 and the Xiaomi Poco X6 Pro 5G 12 512GB smartphones. The MediaTek Dimensity 8300 is a powerful processor with great specs, that boasts 8 cores, 3.35 GHz clock rate, Mali-G615 MP GPU, and a 24 Gb memory support. The CPU is based on the 1x 3.35GHz ARM Cortex-A715 + 3x 3.2GHz ARM Cortex-A715 + 4x 2.2GHz Cortex-A510 architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 7900 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of MediaTek Dimensity 8300?
Specification
Processor name | MediaTek Dimensity 8300 |
---|---|
Release Date | 11/21/2023 |
CPU Architecture | 1x 3.35GHz ARM Cortex-A715 + 3x 3.2GHz ARM Cortex-A715 + 4x 2.2GHz Cortex-A510 |
Number of Cores | 8 |
Clock Rate | 3.35 GHz |
Chip technology | 4 nm |
GPU | Mali-G615 MP |
The highest TDP | 10 |
Memory | 24 Gb |
Features | MediaTek 5G modem |
Upload Speed (up to) | 7900 Mbps |