UNISOC Tiger T606 3DMark Benchmark score
UNISOC Tiger T606 has an 3DMark benchmark score of around 408 points, which ranks it above its competitors like the Huawei HiSilicon Kirin 960 (which received 402 marks in this test). It was used for the Hotwav Cyber 13 and the Doogee Blade 10 Max smartphones. The UNISOC Tiger T606 is a powerful processor with great specs, that boasts 8 cores, 1.6 GHz clock rate, Mali-G57MP GPU, and a 8 Gb memory support. The CPU is based on the 2 x Cortex-A75 1.6GHz + 6 x Cortex-A55 1.6GHz architecture, while the chip is made with 12 nm technology and has a 10 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.


What is the 3DMark Benchmark score of UNISOC Tiger T606?
Specification
Processor name | UNISOC Tiger T606 |
---|---|
Release Date | 9/10/2021 |
CPU Architecture | 2 x Cortex-A75 1.6GHz + 6 x Cortex-A55 1.6GHz |
Number of Cores | 8 |
Clock Rate | 1.6 GHz |
Chip technology | 12 nm |
GPU | Mali-G57MP |
The highest TDP | 10 |
Memory | 8 Gb |
Features | UNISOC modem |
Upload Speed (up to) | 150 Mbps |