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Huawei HiSilicon Kirin 960 3DMark Benchmark score

Huawei HiSilicon Kirin 960 has an 3DMark benchmark score of around 402 points, which ranks it above its competitors like the Samsung Exynos 7904 (which received 399 marks in this test). It was used for the Huawei Mate 9 664 and the Huawei Honor 9 6128 smartphones. The Huawei HiSilicon Kirin 960 is a powerful processor with great specs, that boasts 8 cores, 2.36 GHz clock rate, Mali G71MP GPU, and a 4 Gb memory support. The CPU is based on the 4 x ARM Cortex-A73 2,36 GHz + 4 x ARM Cortex-A53 1,84 GHz architecture, while the chip is made with 16 nm technology and has a 5 TDP. The built-in modem supports speeds up to 50 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Huawei HiSilicon Kirin 960 3DMark Benchmark score
Huawei HiSilicon Kirin 960 3DMark Benchmark score

What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 960?

CPU3DMark benchmark scores
UNISOC Tiger T612 448
Qualcomm Snapdragon 680 445
UNISOC Tiger T7510 433
Samsung Exynos 850 427
UNISOC Tiger T606 408
Huawei HiSilicon Kirin 960 402
Samsung Exynos 7904 399
Qualcomm Snapdragon 662 379
Qualcomm Snapdragon 660 362
Samsung Exynos 7884B 322
Qualcomm Snapdragon 675 311

Specification

Processor nameHuawei HiSilicon Kirin 960
Release Date11/03/2016
CPU Architecture4 x ARM Cortex-A73 2,36 GHz + 4 x ARM Cortex-A53 1,84 GHz
Number of Cores8
Clock Rate2.36 GHz
Chip technology16 nm
GPUMali G71MP
The highest TDP5
Memory4 Gb
FeaturesHuawei HiSilicon modem
Upload Speed (up to)50 Mbps