Huawei HiSilicon Kirin 960 3DMark Benchmark score
Huawei HiSilicon Kirin 960 has an 3DMark benchmark score of around 402 points, which ranks it above its competitors like the Samsung Exynos 7904 (which received 399 marks in this test). It was used for the Huawei Mate 9 664 and the Huawei Honor 9 6128 smartphones. The Huawei HiSilicon Kirin 960 is a powerful processor with great specs, that boasts 8 cores, 2.36 GHz clock rate, Mali G71MP GPU, and a 4 Gb memory support. The CPU is based on the 4 x ARM Cortex-A73 2,36 GHz + 4 x ARM Cortex-A53 1,84 GHz architecture, while the chip is made with 16 nm technology and has a 5 TDP. The built-in modem supports speeds up to 50 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 960?
Specification
Processor name | Huawei HiSilicon Kirin 960 |
---|---|
Release Date | 11/03/2016 |
CPU Architecture | 4 x ARM Cortex-A73 2,36 GHz + 4 x ARM Cortex-A53 1,84 GHz |
Number of Cores | 8 |
Clock Rate | 2.36 GHz |
Chip technology | 16 nm |
GPU | Mali G71MP |
The highest TDP | 5 |
Memory | 4 Gb |
Features | Huawei HiSilicon modem |
Upload Speed (up to) | 50 Mbps |