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MediaTek Dimensity 6300 3DMark Benchmark score

MediaTek Dimensity 6300 has an 3DMark benchmark score of around 1180 points, which ranks it above its competitors like the MediaTek Dimensity 6080 (which received 1167 marks in this test). It was used for the Realme C65 5G and the Realme C65 5G smartphones. The MediaTek Dimensity 6300 is a powerful processor with great specs, that boasts 8 cores, 2.4 GHz clock rate, Mali-G57MC GPU, and a 12 Gb memory support. The CPU is based on the 2x Cortex-A76 2,4 GHz + 6x Cortex-A55 2 GHz architecture, while the chip is made with 6 nm technology and has a 10 TDP. The built-in modem supports speeds up to 211 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 6300 3DMark Benchmark score
MediaTek Dimensity 6300 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 6300?

CPU3DMark benchmark scores
Huawei HiSilicon Kirin 810 1422
MediaTek Helio G90T 1318
MediaTek Dimensity 720 1242
MediaTek Dimensity 810 1228
Qualcomm Snapdragon 695 1211
MediaTek Dimensity 6300 1180
MediaTek Dimensity 6080 1167
MediaTek Dimensity 6100+ 1132
MediaTek Dimensity 6020 1121
Qualcomm Snapdragon 750G 1121
Qualcomm Snapdragon 732G 1117

Specification

Processor nameMediaTek Dimensity 6300
Release Date04/20/2024
CPU Architecture2x Cortex-A76 2,4 GHz + 6x Cortex-A55 2 GHz
Number of Cores8
Clock Rate2.4 GHz
Chip technology6 nm
GPUMali-G57MC
The highest TDP10
Memory12 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)211 Mbps