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MediaTek Dimensity 9000+ 3DMark Benchmark score

MediaTek Dimensity 9000+ has an 3DMark benchmark score of around 8275 points, which ranks it above its competitors like the Qualcomm Snapdragon 8+ Gen 1 (which received 8224 marks in this test). It was used for the Asus ROG Phone 6D and the Asus ROG Phone 6D 16 256GB smartphones. The MediaTek Dimensity 9000+ is a powerful processor with great specs, that boasts 8 cores, 3.2 GHz clock rate, Mali-G710 MC GPU, and a 16 Gb memory support. The CPU is based on the 1 x 3.2GHz Cortex-X2 +3 x 2.85GHz Cortex-A710 + 4 x 1.8GHz Cortex-A510 architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 316 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 9000+ 3DMark Benchmark score
MediaTek Dimensity 9000+ 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 9000+?

CPU3DMark benchmark scores
MediaTek Dimensity 9200+ 11012
MediaTek Dimensity 9200 10289
Qualcomm Snapdragon 7+ Gen 3 10228
Qualcomm Snapdragon 8 Gen 2 9870
Apple A15 Bionic 9558
MediaTek Dimensity 9000+ 8275
Qualcomm Snapdragon 8+ Gen 1 8224
Qualcomm Snapdragon 8 Gen 1 8165
MediaTek Dimensity 9000 7894
Qualcomm Snapdragon 7+ Gen 2 7864
Apple A14 Bionic 7592

Specification

Processor nameMediaTek Dimensity 9000+
Release Date7/4/2022
CPU Architecture1 x 3.2GHz Cortex-X2 +3 x 2.85GHz Cortex-A710 + 4 x 1.8GHz Cortex-A510
Number of Cores8
Clock Rate3.2 GHz
Chip technology4 nm
GPUMali-G710 MC
The highest TDP10
Memory16 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)316 Mbps