MediaTek Dimensity 9000+ 3DMark Benchmark score
MediaTek Dimensity 9000+ has an 3DMark benchmark score of around 8275 points, which ranks it above its competitors like the Qualcomm Snapdragon 8+ Gen 1 (which received 8224 marks in this test). It was used for the Asus ROG Phone 6D and the Asus ROG Phone 6D 16 256GB smartphones. The MediaTek Dimensity 9000+ is a powerful processor with great specs, that boasts 8 cores, 3.2 GHz clock rate, Mali-G710 MC GPU, and a 16 Gb memory support. The CPU is based on the 1 x 3.2GHz Cortex-X2 +3 x 2.85GHz Cortex-A710 + 4 x 1.8GHz Cortex-A510 architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 316 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of MediaTek Dimensity 9000+?
Specification
Processor name | MediaTek Dimensity 9000+ |
---|---|
Release Date | 7/4/2022 |
CPU Architecture | 1 x 3.2GHz Cortex-X2 +3 x 2.85GHz Cortex-A710 + 4 x 1.8GHz Cortex-A510 |
Number of Cores | 8 |
Clock Rate | 3.2 GHz |
Chip technology | 4 nm |
GPU | Mali-G710 MC |
The highest TDP | 10 |
Memory | 16 Gb |
Features | MediaTek 5G modem |
Upload Speed (up to) | 316 Mbps |