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HiSilicon Kirin 8020 3DMark Benchmark score

HiSilicon Kirin 8020 has an 3DMark benchmark score of around 5455 points, which ranks it above its competitors like the MediaTek Dimensity 7200 (which received 5398 marks in this test). It was used for the Huawei Nova 14 Ultra and the Huawei Nova 14 Pro smartphones. The HiSilicon Kirin 8020 is a powerful processor with great specs, that boasts 8 cores, 2.29 GHz clock rate, Maleoon 920 GPU, and a 16 Gb memory support. The CPU is based on the 1 x Taishan V121 2.29GHz + 3 x Taishan V121 2.05GHz + 4 x Taishan Little 1.3GHz architecture, while the chip is made with 7 nm technology and has a 10 TDP. The built-in modem supports speeds up to 2000 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

HiSilicon Kirin 8020 3DMark Benchmark score
HiSilicon Kirin 8020 3DMark Benchmark score

What is the 3DMark Benchmark score of HiSilicon Kirin 8020?

CPU3DMark benchmark scores
Huawei HiSilicon Kirin 9000E 5655
Qualcomm Snapdragon 888 Plus 5622
Samsung Exynos 1080 5587
Samsung Exynos 2100 5543
MediaTek Dimensity 7350 5511
HiSilicon Kirin 8020 5455
MediaTek Dimensity 7200 5398
Qualcomm Snapdragon 888 5308
Apple A12 Bionic 5262
MediaTek Dimensity 8050 4538
Qualcomm Snapdragon 865 4378

Specification

Processor nameHiSilicon Kirin 8020
Release Date05/20/2025
CPU Architecture1 x Taishan V121 2.29GHz + 3 x Taishan V121 2.05GHz + 4 x Taishan Little 1.3GHz
Number of Cores8
Clock Rate2.29 GHz
Chip technology7 nm
GPUMaleoon 920
The highest TDP10
Memory16 Gb
FeaturesKirin 5G modem
Upload Speed (up to)2000 Mbps