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Qualcomm Snapdragon 888 Plus 3DMark Benchmark score

Qualcomm Snapdragon 888 Plus has an 3DMark benchmark score of around 5622 points, which ranks it above its competitors like the Samsung Exynos 1080 (which received 5587 marks in this test). It was used for the Meizu 18s Pro 12 256GB and the Vivo IQOO 8 smartphones. The Qualcomm Snapdragon 888 Plus is a powerful processor with great specs, that boasts 8 cores, 2.9955 GHz clock rate, Adreno 660 GPU, and a 24 Gb memory support. The CPU is based on the 1x 2.9955 GHz ARM Cortex-X1 + 3x 2.42 GHz ARM Cortex-A78 + 4x1.8 GHz ARM Cortex-A55 architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 316 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 888 Plus 3DMark Benchmark score
Qualcomm Snapdragon 888 Plus 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 888 Plus?

CPU3DMark benchmark scores
MediaTek Dimensity 8100 6213
HiSilicon Kirin 9000s 6211
MediaTek Dimensity 8000 6107
Huawei HiSilicon Kirin 9000 6041
Huawei HiSilicon Kirin 9000E 5655
Qualcomm Snapdragon 888 Plus 5622
Samsung Exynos 1080 5587
Samsung Exynos 2100 5543
MediaTek Dimensity 7200 5398
Qualcomm Snapdragon 888 5308
Apple A12 Bionic 5262

Specification

Processor nameQualcomm Snapdragon 888 Plus
Release Date6/15/2021
CPU Architecture1x 2.9955 GHz ARM Cortex-X1 + 3x 2.42 GHz ARM Cortex-A78 + 4x1.8 GHz ARM Cortex-A55
Number of Cores8
Clock Rate2.9955 GHz
Chip technology5 nm
GPUAdreno 660
The highest TDP10
Memory24 Gb
FeaturesSnapdragon X60
Upload Speed (up to)316 Mbps