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MediaTek Dimensity 7200 3DMark Benchmark score

MediaTek Dimensity 7200 has an 3DMark benchmark score of around 5398 points, which ranks it above its competitors like the Qualcomm Snapdragon 888 (which received 5308 marks in this test). It was used for the Vivo T3 5G and the Vivo V27 smartphones. The MediaTek Dimensity 7200 is a powerful processor with great specs, that boasts 8 cores, 2.8 GHz clock rate, Mali-G610 MC GPU, and a 16 Gb memory support. The CPU is based on the 2 x ARM Cortex-A715 2.8GHZ + 6 x ARM Cortex-A510 2GHz architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 300 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 7200 3DMark Benchmark score
MediaTek Dimensity 7200 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 7200?

CPU3DMark benchmark scores
Huawei HiSilicon Kirin 9000 6041
Huawei HiSilicon Kirin 9000E 5655
Qualcomm Snapdragon 888 Plus 5622
Samsung Exynos 1080 5587
Samsung Exynos 2100 5543
MediaTek Dimensity 7200 5398
Qualcomm Snapdragon 888 5308
Apple A12 Bionic 5262
MediaTek Dimensity 8050 4538
Qualcomm Snapdragon 865 4378
Qualcomm Snapdragon 870 4265

Specification

Processor nameMediaTek Dimensity 7200
Release Date02/16/2023
CPU Architecture2 x ARM Cortex-A715 2.8GHZ + 6 x ARM Cortex-A510 2GHz
Number of Cores8
Clock Rate2.8 GHz
Chip technology4 nm
GPUMali-G610 MC
The highest TDP10
Memory16 Gb
Features
Upload Speed (up to)300 Mbps