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Qualcomm Snapdragon 7s Gen 3 3DMark Benchmark score

Qualcomm Snapdragon 7s Gen 3 has an 3DMark benchmark score of around 3117 points, which ranks it above its competitors like the MediaTek Dimensity 1050 (which received 2893 marks in this test). It was used for the Xiaomi Redmi Note 14 Pro Plus and the Xiaomi Poco X7 smartphones. The Qualcomm Snapdragon 7s Gen 3 is a powerful processor with great specs, that boasts 8 cores, 2.4 GHz clock rate, Adreno 810 GPU, and a 16 Gb memory support. The CPU is based on the 1x 2.5GHz Cortex-A715 + 3x 2.4GHz Cortex-A715 + 4x 1.8GHz Cortex-A510 architecture, while the chip is made with 4 nm technology and has a 8 TDP. The built-in modem supports speeds up to 2000 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 7s Gen 3 3DMark Benchmark score
Qualcomm Snapdragon 7s Gen 3 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 7s Gen 3?

CPU3DMark benchmark scores
Huawei HiSilicon Kirin 990 3291
Apple A11 Bionic 3221
Huawei HiSilicon Kirin 990E 3217
Samsung Exynos 9820 3153
Qualcomm Snapdragon 780G 3127
Qualcomm Snapdragon 7s Gen 3 3117
MediaTek Dimensity 1050 2893
Qualcomm QCM6490 2889
MediaTek Dimensity 7030 2855
Qualcomm Snapdragon 855 2755
Qualcomm Snapdragon 7s Gen 2 2677

Specification

Processor nameQualcomm Snapdragon 7s Gen 3
Release Date07/25/2024
CPU Architecture1x 2.5GHz Cortex-A715 + 3x 2.4GHz Cortex-A715 + 4x 1.8GHz Cortex-A510
Number of Cores8
Clock Rate2.4 GHz
Chip technology4 nm
GPUAdreno 810
The highest TDP8
Memory16 Gb
FeaturesSnapdragon modem
Upload Speed (up to)2000 Mbps