Qualcomm QCM6490 3DMark Benchmark score
Qualcomm QCM6490 has an 3DMark benchmark score of around 2889 points, which ranks it above its competitors like the MediaTek Dimensity 7030 (which received 2855 marks in this test). It was used for the AGM G2 and the AGM G2 Pro smartphones. The Qualcomm QCM6490 is a powerful processor with great specs, that boasts 8 cores, 2.7 GHz clock rate, Adreno 643L GPU, and a 16 Gb memory support. The CPU is based on the 1 x Cortex-A78 2.7Ghz + 3 x Cortex-A78 2.4Ghz + 4 x Cortex-A55 1.9Ghz architecture, while the chip is made with 6 nm technology and has a 6 TDP. The built-in modem supports speeds up to 500 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Qualcomm QCM6490?
Specification
Processor name | Qualcomm QCM6490 |
---|---|
Release Date | 07/15/2021 |
CPU Architecture | 1 x Cortex-A78 2.7Ghz + 3 x Cortex-A78 2.4Ghz + 4 x Cortex-A55 1.9Ghz |
Number of Cores | 8 |
Clock Rate | 2.7 GHz |
Chip technology | 6 nm |
GPU | Adreno 643L |
The highest TDP | 6 |
Memory | 16 Gb |
Features | Qualcomm 5G modem |
Upload Speed (up to) | 500 Mbps |