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Qualcomm QCM6490 3DMark Benchmark score

Qualcomm QCM6490 has an 3DMark benchmark score of around 2889 points, which ranks it above its competitors like the MediaTek Dimensity 7030 (which received 2855 marks in this test). It was used for the AGM G2 and the AGM G2 Pro smartphones. The Qualcomm QCM6490 is a powerful processor with great specs, that boasts 8 cores, 2.7 GHz clock rate, Adreno 643L GPU, and a 16 Gb memory support. The CPU is based on the 1 x Cortex-A78 2.7Ghz + 3 x Cortex-A78 2.4Ghz + 4 x Cortex-A55 1.9Ghz architecture, while the chip is made with 6 nm technology and has a 6 TDP. The built-in modem supports speeds up to 500 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm QCM6490 3DMark Benchmark score
Qualcomm QCM6490 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm QCM6490?

CPU3DMark benchmark scores
Apple A11 Bionic 3221
Huawei HiSilicon Kirin 990E 3217
Samsung Exynos 9820 3153
Qualcomm Snapdragon 780G 3127
MediaTek Dimensity 1050 2893
Qualcomm QCM6490 2889
MediaTek Dimensity 7030 2855
Qualcomm Snapdragon 855 2755
Qualcomm Snapdragon 7s Gen 2 2677
Apple A10 Fusion 2591
Qualcomm Snapdragon 782G 2557

Specification

Processor nameQualcomm QCM6490
Release Date07/15/2021
CPU Architecture1 x Cortex-A78 2.7Ghz + 3 x Cortex-A78 2.4Ghz + 4 x Cortex-A55 1.9Ghz
Number of Cores8
Clock Rate2.7 GHz
Chip technology6 nm
GPUAdreno 643L
The highest TDP6
Memory16 Gb
FeaturesQualcomm 5G modem
Upload Speed (up to)500 Mbps