Qualcomm Snapdragon 8s Gen 3 3DMark Benchmark score
Qualcomm Snapdragon 8s Gen 3 has an 3DMark benchmark score of around 13783 points, which ranks it above its competitors like the Qualcomm Snapdragon 8 Gen 3 (which received 13177 marks in this test). It was used for the Xiaomi Civi 4 Pro and the Honor 200 Pro smartphones. The Qualcomm Snapdragon 8s Gen 3 is a powerful processor with great specs, that boasts 8 cores, 3 GHz clock rate, Adreno 735 GPU, and a 24 Gb memory support. The CPU is based on the 1x 3 GHz ARM Cortex-X4 + 4x 2.8 GHz ARM Cortex-A720 + 3x 2 GHz ARM Cortex-A520 architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 6500 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Qualcomm Snapdragon 8s Gen 3?
Specification
Processor name | Qualcomm Snapdragon 8s Gen 3 |
---|---|
Release Date | 03/22/2024 |
CPU Architecture | 1x 3 GHz ARM Cortex-X4 + 4x 2.8 GHz ARM Cortex-A720 + 3x 2 GHz ARM Cortex-A520 |
Number of Cores | 8 |
Clock Rate | 3 GHz |
Chip technology | 4 nm |
GPU | Adreno 735 |
The highest TDP | 10 |
Memory | 24 Gb |
Features | Snapdragon X70 |
Upload Speed (up to) | 6500 Mbps |