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Qualcomm Snapdragon 8s Gen 3 3DMark Benchmark score

Qualcomm Snapdragon 8s Gen 3 has an 3DMark benchmark score of around 13783 points, which ranks it above its competitors like the Qualcomm Snapdragon 8 Gen 3 (which received 13177 marks in this test). It was used for the Xiaomi Civi 4 Pro and the Honor 200 Pro smartphones. The Qualcomm Snapdragon 8s Gen 3 is a powerful processor with great specs, that boasts 8 cores, 3 GHz clock rate, Adreno 735 GPU, and a 24 Gb memory support. The CPU is based on the 1x 3 GHz ARM Cortex-X4 + 4x 2.8 GHz ARM Cortex-A720 + 3x 2 GHz ARM Cortex-A520 architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 6500 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 8s Gen 3 3DMark Benchmark score
Qualcomm Snapdragon 8s Gen 3 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 8s Gen 3?

CPU3DMark benchmark scores
Qualcomm Snapdragon 8 Gen 4 19883
MediaTek Dimensity 9300+ 15004
MediaTek Dimensity 9300 14398
Qualcomm Snapdragon 8 Gen 3 Leading Version 13897
Qualcomm Snapdragon 8s Gen 3 13783
Qualcomm Snapdragon 8 Gen 3 13177
Apple A17 Pro 12658
Qualcomm Snapdragon 8+ Gen 2 11341
Apple A16 Bionic 11022
MediaTek Dimensity 9200+ 11012
Samsung Exynos 2400e 10317

Specification

Processor nameQualcomm Snapdragon 8s Gen 3
Release Date03/22/2024
CPU Architecture1x 3 GHz ARM Cortex-X4 + 4x 2.8 GHz ARM Cortex-A720 + 3x 2 GHz ARM Cortex-A520
Number of Cores8
Clock Rate3 GHz
Chip technology4 nm
GPUAdreno 735
The highest TDP10
Memory24 Gb
FeaturesSnapdragon X70
Upload Speed (up to)6500 Mbps