UNISOC T750 3DMark Benchmark score
UNISOC T750 has an 3DMark benchmark score of around 1011 points, which ranks it above its competitors like the Qualcomm Snapdragon 480+ (which received 989 marks in this test). It was used for the AGM X6 and the AGM X6 smartphones. The UNISOC T750 is a powerful processor with great specs, that boasts 8 cores, 2 GHz clock rate, Mali G57MС GPU, and a 12 Gb memory support. The CPU is based on the 2x Cortex-A76 2 GHz + 6x Cortex-A55 1,8 GHz architecture, while the chip is made with 6 nm technology and has a 8 TDP. The built-in modem supports speeds up to 250 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.


What is the 3DMark Benchmark score of UNISOC T750?
Specification
Processor name | UNISOC T750 |
---|---|
Release Date | 04/20/2023 |
CPU Architecture | 2x Cortex-A76 2 GHz + 6x Cortex-A55 1,8 GHz |
Number of Cores | 8 |
Clock Rate | 2 GHz |
Chip technology | 6 nm |
GPU | Mali G57MС |
The highest TDP | 8 |
Memory | 12 Gb |
Features | UNISOC 5G modem |
Upload Speed (up to) | 250 Mbps |