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UNISOC T765 3DMark Benchmark score

UNISOC T765 has an 3DMark benchmark score of around 1099 points, which ranks it above its competitors like the MediaTek Helio G96 (which received 1084 marks in this test). It was used for the UMIDIGI G9 and the UMIDIGI G9 smartphones. The UNISOC T765 is a powerful processor with great specs, that boasts 8 cores, 2.3 GHz clock rate, Mali-G57 MC GPU, and a 12 Gb memory support. The CPU is based on the 2x Cortex-A76 2,3 GHz + 6x Cortex-A55 2,1 GHz architecture, while the chip is made with 6 nm technology and has a 8 TDP. The built-in modem supports speeds up to 250 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

UNISOC T765 3DMark Benchmark score
UNISOC T765 3DMark Benchmark score

What is the 3DMark Benchmark score of UNISOC T765?

CPU3DMark benchmark scores
MediaTek Dimensity 6020 1121
Qualcomm Snapdragon 750G 1121
Qualcomm Snapdragon 732G 1117
MediaTek Dimensity 700 1102
MediaTek Helio G99 1101
UNISOC T765 1099
MediaTek Helio G96 1084
Qualcomm Snapdragon 835 1069
Qualcomm Snapdragon 690 1039
Qualcomm Snapdragon 480+ 989
Qualcomm Snapdragon 480 987

Specification

Processor nameUNISOC T765
Release Date01/15/2024
CPU Architecture2x Cortex-A76 2,3 GHz + 6x Cortex-A55 2,1 GHz
Number of Cores8
Clock Rate2.3 GHz
Chip technology6 nm
GPUMali-G57 MC
The highest TDP8
Memory12 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)250 Mbps