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Qualcomm Snapdragon 835 3DMark Benchmark score

Qualcomm Snapdragon 835 has an 3DMark benchmark score of around 1069 points, which ranks it above its competitors like the Qualcomm Snapdragon 690 (which received 1039 marks in this test). It was used for the Xiaomi MI6 C and the LeEco Le X smartphones. The Qualcomm Snapdragon 835 is a powerful processor with great specs, that boasts 8 cores, 2.45 GHz clock rate, Adreno 540 GPU, and a 8 Gb memory support. The CPU is based on the 4x 2.45GHz Cortex-A73 + 4x 1.9GHz Cortex-A53 architecture, while the chip is made with 10 nm technology and has a 9 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 835 3DMark Benchmark score
Qualcomm Snapdragon 835 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 835?

CPU3DMark benchmark scores
Qualcomm Snapdragon 750G 1121
Qualcomm Snapdragon 732G 1117
MediaTek Dimensity 700 1102
MediaTek Helio G99 1101
MediaTek Helio G96 1084
Qualcomm Snapdragon 835 1069
Qualcomm Snapdragon 690 1039
Qualcomm Snapdragon 480+ 989
Qualcomm Snapdragon 480 987
Samsung Exynos 8895 872
Huawei HiSilicon Kirin 970 834

Specification

Processor nameQualcomm Snapdragon 835
Release Date03/22/2017
CPU Architecture4x 2.45GHz Cortex-A73 + 4x 1.9GHz Cortex-A53
Number of Cores8
Clock Rate2.45 GHz
Chip technology10 nm
GPUAdreno 540
The highest TDP9
Memory8 Gb
FeaturesSnapdragon X16
Upload Speed (up to)150 Mbps