Qualcomm Snapdragon 835 3DMark Benchmark score
Qualcomm Snapdragon 835 has an 3DMark benchmark score of around 1069 points, which ranks it above its competitors like the Qualcomm Snapdragon 690 (which received 1039 marks in this test). It was used for the Xiaomi MI6 C and the LeEco Le X smartphones. The Qualcomm Snapdragon 835 is a powerful processor with great specs, that boasts 8 cores, 2.45 GHz clock rate, Adreno 540 GPU, and a 8 Gb memory support. The CPU is based on the 4x 2.45GHz Cortex-A73 + 4x 1.9GHz Cortex-A53 architecture, while the chip is made with 10 nm technology and has a 9 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Qualcomm Snapdragon 835?
Specification
Processor name | Qualcomm Snapdragon 835 |
---|---|
Release Date | 03/22/2017 |
CPU Architecture | 4x 2.45GHz Cortex-A73 + 4x 1.9GHz Cortex-A53 |
Number of Cores | 8 |
Clock Rate | 2.45 GHz |
Chip technology | 10 nm |
GPU | Adreno 540 |
The highest TDP | 9 |
Memory | 8 Gb |
Features | Snapdragon X16 |
Upload Speed (up to) | 150 Mbps |