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HiSilicon Kirin 9010s 3DMark Benchmark score

HiSilicon Kirin 9010s has an 3DMark benchmark score of around 6658 points, which ranks it above its competitors like the Google Tensor G3 (which received 6657 marks in this test). It was used for the Huawei Nova 15 Pro and the Huawei Nova 15 Pro smartphones. The HiSilicon Kirin 9010s is a powerful processor with great specs, that boasts 12 cores, 2.5 GHz clock rate, Maleoon 910 GPU, and a 24 Gb memory support. The CPU is based on the 1 x TaiShan V121 2.5GHz + 3 x TaiShan V121 2.25GHz + 6 x Cortex-A510 1.55GHz architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 4600 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

HiSilicon Kirin 9010s 3DMark Benchmark score
HiSilicon Kirin 9010s 3DMark Benchmark score

What is the 3DMark Benchmark score of HiSilicon Kirin 9010s?

CPU3DMark benchmark scores
Apple A14 Bionic 7592
Apple A13 Bionic 7578
MediaTek Dimensity 8300 7076
Samsung Exynos 2200 6902
HiSilicon Kirin 9020 6893
HiSilicon Kirin 9010s 6658
Google Tensor G3 6657
HiSilicon Kirin 9030 6511
HiSilicon Kirin 9010 6453
Google Tensor G2 6398
MediaTek Dimensity 8250 6311

Specification

Processor nameHiSilicon Kirin 9010s
Release Date10/15/2025
CPU Architecture1 x TaiShan V121 2.5GHz + 3 x TaiShan V121 2.25GHz + 6 x Cortex-A510 1.55GHz
Number of Cores12
Clock Rate2.5 GHz
Chip technology5 nm
GPUMaleoon 910
The highest TDP10
Memory24 Gb
FeaturesBalong 5000
Upload Speed (up to)4600 Mbps