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MediaTek Dimensity 8250 3DMark Benchmark score

MediaTek Dimensity 8250 has an 3DMark benchmark score of around 6311 points, which ranks it above its competitors like the Qualcomm Snapdragon 7 Gen 3 (which received 6255 marks in this test). It was used for the Oppo Reno 12 and the Oppo Reno 12 smartphones. The MediaTek Dimensity 8250 is a powerful processor with great specs, that boasts 8 cores, 3.1 GHz clock rate, Mali-G610 MC GPU, and a 16 Gb memory support. The CPU is based on the 1x Cortex-A710 3.1Ghz + 1x Cortex-A710 3.0Ghz + 4x Cortex-A510 2Ghz architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 1000 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 8250 3DMark Benchmark score
MediaTek Dimensity 8250 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 8250?

CPU3DMark benchmark scores
Samsung Exynos 2200 6902
HiSilicon Kirin 9020 6893
Google Tensor G3 6657
HiSilicon Kirin 9010 6453
Google Tensor G2 6398
MediaTek Dimensity 8250 6311
Qualcomm Snapdragon 7 Gen 3 6255
Google Tensor 6220
MediaTek Dimensity 8100 6213
HiSilicon Kirin 9000s 6211
MediaTek Dimensity 8200 6188

Specification

Processor nameMediaTek Dimensity 8250
Release Date11/20/2024
CPU Architecture1x Cortex-A710 3.1Ghz + 1x Cortex-A710 3.0Ghz + 4x Cortex-A510 2Ghz
Number of Cores8
Clock Rate3.1 GHz
Chip technology4 nm
GPUMali-G610 MC
The highest TDP10
Memory16 Gb
FeaturesMediaTek Custom Integrated 5G modem
Upload Speed (up to)1000 Mbps