HiSilicon Kirin 9010 3DMark Benchmark score
HiSilicon Kirin 9010 has an 3DMark benchmark score of around 6453 points, which ranks it above its competitors like the Google Tensor G2 (which received 6398 marks in this test). It was used for the Huawei Mate 70 and the Huawei Pura 70 Ultra smartphones. The HiSilicon Kirin 9010 is a powerful processor with great specs, that boasts 12 cores, 2.3 GHz clock rate, Maleoon-910 MP GPU, and a 24 Gb memory support. The CPU is based on the 2 x TaiShan V121 2.3GHz + 4 x TaiShan V121 2.18GHz + 6 x Cortex-A510 1.55GHz architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 4600 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of HiSilicon Kirin 9010?
Specification
Processor name | HiSilicon Kirin 9010 |
---|---|
Release Date | 04/10/2024 |
CPU Architecture | 2 x TaiShan V121 2.3GHz + 4 x TaiShan V121 2.18GHz + 6 x Cortex-A510 1.55GHz |
Number of Cores | 12 |
Clock Rate | 2.3 GHz |
Chip technology | 5 nm |
GPU | Maleoon-910 MP |
The highest TDP | 10 |
Memory | 24 Gb |
Features | Balong 5000 |
Upload Speed (up to) | 4600 Mbps |