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Huawei HiSilicon Kirin 655 3DMark Benchmark score

Huawei HiSilicon Kirin 655 has an 3DMark benchmark score of around 108 points, which ranks it above its competitors like the Huawei HiSilicon Kirin 920 (which received 108 marks in this test). It was used for the Huawei Honor 6X 64 and the Huawei Honor 6X smartphones. The Huawei HiSilicon Kirin 655 is a powerful processor with great specs, that boasts 8 cores, 2.12 GHz clock rate, Mali T830MP GPU, and a 4 Gb memory support. The CPU is based on the 4 x ARM Cortex-A53 2,12 GHz + 4 x ARM Cortex-A53 1,7 GHz architecture, while the chip is made with 16 nm technology and has a 5 TDP. The built-in modem supports speeds up to 50 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Huawei HiSilicon Kirin 655 3DMark Benchmark score
Huawei HiSilicon Kirin 655 3DMark Benchmark score

What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 655?

CPU3DMark benchmark scores
MediaTek Helio P35 118
Qualcomm Snapdragon 430 118
MediaTek Helio G25 111
Xiaomi Surge S1 111
MediaTek Helio A25 110
Huawei HiSilicon Kirin 655 108
Huawei HiSilicon Kirin 920 108
Qualcomm Snapdragon 429 108
MediaTek Helio P15 105
MediaTek MT6595 105
Huawei HiSilicon Kirin 650 103

Specification

Processor nameHuawei HiSilicon Kirin 655
Release Date12/1/2016
CPU Architecture4 x ARM Cortex-A53 2,12 GHz + 4 x ARM Cortex-A53 1,7 GHz
Number of Cores8
Clock Rate2.12 GHz
Chip technology16 nm
GPUMali T830MP
The highest TDP5
Memory4 Gb
FeaturesHuawei HiSilicon modem
Upload Speed (up to)50 Mbps