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Huawei HiSilicon Kirin 955 3DMark Benchmark score

Huawei HiSilicon Kirin 955 has an 3DMark benchmark score of around 249 points, which ranks it above its competitors like the Qualcomm Snapdragon 460 (which received 245 marks in this test). It was used for the Huawei Honor Note 8 128 and the Huawei P9 smartphones. The Huawei HiSilicon Kirin 955 is a powerful processor with great specs, that boasts 8 cores, 2.5 GHz clock rate, Mali T880MP GPU, and a 4 Gb memory support. The CPU is based on the 4 x ARM Cortex-A72 2,5 GHz + 4 x ARM Cortex-A53 1,8 GHz architecture, while the chip is made with 16 nm technology and has a 5 TDP. The built-in modem supports speeds up to 50 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Huawei HiSilicon Kirin 955 3DMark Benchmark score
Huawei HiSilicon Kirin 955 3DMark Benchmark score

What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 955?

CPU3DMark benchmark scores
Qualcomm Snapdragon 660 362
Samsung Exynos 7884B 322
Qualcomm Snapdragon 675 311
MediaTek MT6799 / Helio X30 279
Qualcomm Snapdragon 636 277
Huawei HiSilicon Kirin 955 249
Qualcomm Snapdragon 460 245
Huawei HiSilicon Kirin 950 233
MediaTek Helio X27 233
Qualcomm Snapdragon 665 223
MediaTek MT6797T / Helio X25 221

Specification

Processor nameHuawei HiSilicon Kirin 955
Release Date9/4/2016
CPU Architecture4 x ARM Cortex-A72 2,5 GHz + 4 x ARM Cortex-A53 1,8 GHz
Number of Cores8
Clock Rate2.5 GHz
Chip technology16 nm
GPUMali T880MP
The highest TDP5
Memory4 Gb
FeaturesHuawei HiSilicon modem
Upload Speed (up to)50 Mbps