Huawei HiSilicon Kirin 955 3DMark Benchmark score
Huawei HiSilicon Kirin 955 has an 3DMark benchmark score of around 249 points, which ranks it above its competitors like the Qualcomm Snapdragon 460 (which received 245 marks in this test). It was used for the Huawei Honor Note 8 128 and the Huawei P9 smartphones. The Huawei HiSilicon Kirin 955 is a powerful processor with great specs, that boasts 8 cores, 2.5 GHz clock rate, Mali T880MP GPU, and a 4 Gb memory support. The CPU is based on the 4 x ARM Cortex-A72 2,5 GHz + 4 x ARM Cortex-A53 1,8 GHz architecture, while the chip is made with 16 nm technology and has a 5 TDP. The built-in modem supports speeds up to 50 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 955?
Specification
Processor name | Huawei HiSilicon Kirin 955 |
---|---|
Release Date | 9/4/2016 |
CPU Architecture | 4 x ARM Cortex-A72 2,5 GHz + 4 x ARM Cortex-A53 1,8 GHz |
Number of Cores | 8 |
Clock Rate | 2.5 GHz |
Chip technology | 16 nm |
GPU | Mali T880MP |
The highest TDP | 5 |
Memory | 4 Gb |
Features | Huawei HiSilicon modem |
Upload Speed (up to) | 50 Mbps |