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MediaTek Dimensity 6100+ Geekbench Benchmark score

MediaTek Dimensity 6100+ has been tested at 1965 / 647 points on Geekbench benchmark. That puts it ahead of its competitors, such as the Huawei HiSilicon Kirin 810, which received a score around 1944 / 601 points in this test. We've seen it present in phones like the Samsung Galaxy A15 5G and OUKITEL WP33 Pro. The main specification is 2x Cortex-A76 2,2 GHz + 6x Cortex-A55 2 GHz architecture, it supports memory up to 12 Gb, made with use 6 nm technology, and has 10 TDP. MediaTek Dimensity 6100+ has 8 cores, which means it's ready to multitask and get things done quickly. The GPU is Mali-G57MC and the CPU has a clock rate up to 2.2 GHz. You'll also get a built-in modem with a connection speed of up to 250 Mbps. You can compare this chipset rank with others in the datasheet below.

MediaTek Dimensity 6100+ Geekbench Benchmark score
MediaTek Dimensity 6100+ Geekbench Benchmark score
MediaTek Dimensity 6100+ Geekbench Benchmark score

What is the Geekbench Benchmark score of MediaTek Dimensity 6100+?

CPUGeekbench benchmark scores
Qualcomm Snapdragon 695 2002/679
MediaTek Dimensity 6080 1989/662
MediaTek Dimensity 700 1981/656
Qualcomm Snapdragon 765 1968/674
MediaTek Dimensity 6020 1966/648
MediaTek Dimensity 6100+ 1965/647
Huawei HiSilicon Kirin 810 1944/601
Qualcomm Snapdragon 7+ Gen 3 1921/5112
MediaTek Dimensity 800U 1911/612
MediaTek Helio G99 1875/565
MediaTek Helio G96 1871/559

Specification

Processor nameMediaTek Dimensity 6100+
Release Date07/15/2023
CPU Architecture2x Cortex-A76 2,2 GHz + 6x Cortex-A55 2 GHz
Number of Cores8
Clock Rate2.2 GHz
Chip technology6 nm
GPUMali-G57MC
The highest TDP10
Memory12 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)250 Mbps