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MediaTek Dimensity 7300 3DMark Benchmark score

MediaTek Dimensity 7300 has an 3DMark benchmark score of around 3451 points, which ranks it above its competitors like the Samsung Exynos 9825 (which received 3320 marks in this test). It was used for the ZTE Nubia Flip 2 and the Vivo iQOO Z9s smartphones. The MediaTek Dimensity 7300 is a powerful processor with great specs, that boasts 8 cores, 2.5 GHz clock rate, Mali-G615 MP GPU, and a 16 Gb memory support. The CPU is based on the 4 x ARM Cortex-A78 2.5GHz + 4 x ARM Cortex-A55 2GHz architecture, while the chip is made with 4 nm technology and has a 7 TDP. The built-in modem supports speeds up to 1400 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 7300 3DMark Benchmark score
MediaTek Dimensity 7300 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 7300?

CPU3DMark benchmark scores
Qualcomm Snapdragon 7 Gen 1 3894
Samsung Exynos 990 3822
MediaTek Dimensity 1000 Plus 3735
MediaTek Dimensity 1000 3589
Qualcomm Snapdragon 860 3457
MediaTek Dimensity 7300 3451
Samsung Exynos 9825 3320
Huawei HiSilicon Kirin 990 3291
Apple A11 Bionic 3221
Huawei HiSilicon Kirin 990E 3217
Samsung Exynos 9820 3153

Specification

Processor nameMediaTek Dimensity 7300
Release Date06/18/2024
CPU Architecture4 x ARM Cortex-A78 2.5GHz + 4 x ARM Cortex-A55 2GHz
Number of Cores8
Clock Rate2.5 GHz
Chip technology4 nm
GPUMali-G615 MP
The highest TDP7
Memory16 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)1400 Mbps