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Qualcomm Snapdragon 860 3DMark Benchmark score

Qualcomm Snapdragon 860 has an 3DMark benchmark score of around 3457 points, which ranks it above its competitors like the MediaTek Dimensity 7300 (which received 3451 marks in this test). It was used for the Realme X7 Pro Ultra and the Xiaomi Poco X3 Pro 8 256Gb RU smartphones. The Qualcomm Snapdragon 860 is a powerful processor with great specs, that boasts 8 cores, 2.96 GHz clock rate, Adreno 640 GPU, and a 16 Gb memory support. The CPU is based on the 1x 2.96 GHz ARM Cortex-A76 + 3x 2.42 GHz ARM Cortex-A76 + 4x1.8 GHz ARM Cortex-A55 architecture, while the chip is made with 7 nm technology and has a 10 TDP. The built-in modem supports speeds up to 316 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 860 3DMark Benchmark score
Qualcomm Snapdragon 860 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 860?

CPU3DMark benchmark scores
MediaTek Dimensity 1100 3980
Qualcomm Snapdragon 7 Gen 1 3894
Samsung Exynos 990 3822
MediaTek Dimensity 1000 Plus 3735
MediaTek Dimensity 1000 3589
Qualcomm Snapdragon 860 3457
MediaTek Dimensity 7300 3451
Samsung Exynos 9825 3320
Huawei HiSilicon Kirin 990 3291
Apple A11 Bionic 3221
Huawei HiSilicon Kirin 990E 3217

Specification

Processor nameQualcomm Snapdragon 860
Release Date4/25/2019
CPU Architecture1x 2.96 GHz ARM Cortex-A76 + 3x 2.42 GHz ARM Cortex-A76 + 4x1.8 GHz ARM Cortex-A55
Number of Cores8
Clock Rate2.96 GHz
Chip technology7 nm
GPUAdreno 640
The highest TDP10
Memory16 Gb
FeaturesSnapdragon X24
Upload Speed (up to)316 Mbps