Qualcomm Snapdragon 860 3DMark Benchmark score
Qualcomm Snapdragon 860 has an 3DMark benchmark score of around 3457 points, which ranks it above its competitors like the MediaTek Dimensity 7300 (which received 3451 marks in this test). It was used for the Realme X7 Pro Ultra and the Xiaomi Poco X3 Pro 8 256Gb RU smartphones. The Qualcomm Snapdragon 860 is a powerful processor with great specs, that boasts 8 cores, 2.96 GHz clock rate, Adreno 640 GPU, and a 16 Gb memory support. The CPU is based on the 1x 2.96 GHz ARM Cortex-A76 + 3x 2.42 GHz ARM Cortex-A76 + 4x1.8 GHz ARM Cortex-A55 architecture, while the chip is made with 7 nm technology and has a 10 TDP. The built-in modem supports speeds up to 316 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Qualcomm Snapdragon 860?
Specification
Processor name | Qualcomm Snapdragon 860 |
---|---|
Release Date | 4/25/2019 |
CPU Architecture | 1x 2.96 GHz ARM Cortex-A76 + 3x 2.42 GHz ARM Cortex-A76 + 4x1.8 GHz ARM Cortex-A55 |
Number of Cores | 8 |
Clock Rate | 2.96 GHz |
Chip technology | 7 nm |
GPU | Adreno 640 |
The highest TDP | 10 |
Memory | 16 Gb |
Features | Snapdragon X24 |
Upload Speed (up to) | 316 Mbps |