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MediaTek Dimensity 800 3DMark Benchmark score

MediaTek Dimensity 800 has an 3DMark benchmark score of around 1982 points, which ranks it above its competitors like the Qualcomm Snapdragon 768G (which received 1950 marks in this test). It was used for the UMIDIGI S6 Pro and the Huawei Honor 30 Lite 5G smartphones. The MediaTek Dimensity 800 is a powerful processor with great specs, that boasts 8 cores, 2 GHz clock rate, Mali-G57MP GPU, and a 16 Gb memory support. The CPU is based on the 4x Cortex-A76 (2 GHz) + 4x Cortex-A55 (2 GHz) architecture, while the chip is made with 7 nm technology and has a 10 TDP. The built-in modem supports speeds up to 211 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 800 3DMark Benchmark score
MediaTek Dimensity 800 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 800?

CPU3DMark benchmark scores
Qualcomm Snapdragon 6 Gen 1 2211
Huawei HiSilicon Kirin 985 2145
Qualcomm Snapdragon 4 Gen 1 2088
MediaTek Dimensity 900 2034
Huawei HiSilicon Kirin 820 1984
MediaTek Dimensity 800 1982
Qualcomm Snapdragon 768G 1950
Samsung Exynos 980 1894
Samsung Exynos 1280 1827
Samsung Exynos 880 1822
UNISOC T820 1772

Specification

Processor nameMediaTek Dimensity 800
Release Date12
CPU Architecture4x Cortex-A76 (2 GHz) + 4x Cortex-A55 (2 GHz)
Number of Cores8
Clock Rate2 GHz
Chip technology7 nm
GPUMali-G57MP
The highest TDP10
Memory16 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)211 Mbps