Huawei HiSilicon Kirin 820 3DMark Benchmark score
Huawei HiSilicon Kirin 820 has an 3DMark benchmark score of around 1984 points, which ranks it above its competitors like the MediaTek Dimensity 800 (which received 1982 marks in this test). It was used for the Huawei Nova 12 and the Huawei Honor 10X 6 128Gb smartphones. The Huawei HiSilicon Kirin 820 is a powerful processor with great specs, that boasts 8 cores, 2.36 GHz clock rate, Mali-G57MP GPU, and a 12 Gb memory support. The CPU is based on the 1 x 2.36 GHz ARM Cortex-A76 + 3 x 2.22 GHz ARM Cortex-A76 + 4 x 1,84 GHz ARM Cortex-A55 architecture, while the chip is made with 7 nm technology and has a 5 TDP. The built-in modem supports speeds up to 200 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 820?
Specification
Processor name | Huawei HiSilicon Kirin 820 |
---|---|
Release Date | 3/30/2021 |
CPU Architecture | 1 x 2.36 GHz ARM Cortex-A76 + 3 x 2.22 GHz ARM Cortex-A76 + 4 x 1,84 GHz ARM Cortex-A55 |
Number of Cores | 8 |
Clock Rate | 2.36 GHz |
Chip technology | 7 nm |
GPU | Mali-G57MP |
The highest TDP | 5 |
Memory | 12 Gb |
Features | Balong 5000 |
Upload Speed (up to) | 200 Mbps |