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Huawei HiSilicon Kirin 820 3DMark Benchmark score

Huawei HiSilicon Kirin 820 has an 3DMark benchmark score of around 1984 points, which ranks it above its competitors like the MediaTek Dimensity 800 (which received 1982 marks in this test). It was used for the Huawei Nova 12 and the Huawei Honor 10X 6 128Gb smartphones. The Huawei HiSilicon Kirin 820 is a powerful processor with great specs, that boasts 8 cores, 2.36 GHz clock rate, Mali-G57MP GPU, and a 12 Gb memory support. The CPU is based on the 1 x 2.36 GHz ARM Cortex-A76 + 3 x 2.22 GHz ARM Cortex-A76 + 4 x 1,84 GHz ARM Cortex-A55 architecture, while the chip is made with 7 nm technology and has a 5 TDP. The built-in modem supports speeds up to 200 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Huawei HiSilicon Kirin 820 3DMark Benchmark score
Huawei HiSilicon Kirin 820 3DMark Benchmark score

What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 820?

CPU3DMark benchmark scores
Samsung Exynos 1380 2235
Qualcomm Snapdragon 6 Gen 1 2211
Huawei HiSilicon Kirin 985 2145
Qualcomm Snapdragon 4 Gen 1 2088
MediaTek Dimensity 900 2034
Huawei HiSilicon Kirin 820 1984
MediaTek Dimensity 800 1982
Qualcomm Snapdragon 768G 1950
Qualcomm Snapdragon 4s Gen 2 1943
MediaTek Dimensity 7025 1895
Samsung Exynos 980 1894

Specification

Processor nameHuawei HiSilicon Kirin 820
Release Date3/30/2021
CPU Architecture1 x 2.36 GHz ARM Cortex-A76 + 3 x 2.22 GHz ARM Cortex-A76 + 4 x 1,84 GHz ARM Cortex-A55
Number of Cores8
Clock Rate2.36 GHz
Chip technology7 nm
GPUMali-G57MP
The highest TDP5
Memory12 Gb
FeaturesBalong 5000
Upload Speed (up to)200 Mbps