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MediaTek Dimensity 8400 3DMark Benchmark score

MediaTek Dimensity 8400 has an 3DMark benchmark score of around 11315 points, which ranks it above its competitors like the Apple A16 Bionic (which received 11022 marks in this test). It was used for the Xiaomi Redmi Turbo 4 and the Realme Neo 7 SE smartphones. The MediaTek Dimensity 8400 is a powerful processor with great specs, that boasts 8 cores, 3.25 GHz clock rate, ARM Mali Immortalis G720 MC GPU, and a 24 Gb memory support. The CPU is based on the 1x 3.25GHz ARM Cortex-A725 + 3x 3.0GHz ARM Cortex-A725 + 4x 2.1GHz Cortex-A725 architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 3000 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 8400 3DMark Benchmark score
MediaTek Dimensity 8400 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 8400?

CPU3DMark benchmark scores
Qualcomm Snapdragon 8 Gen 3 Leading Version 13897
Qualcomm Snapdragon 8s Gen 3 13783
Qualcomm Snapdragon 8 Gen 3 13177
Apple A17 Pro 12658
Qualcomm Snapdragon 8+ Gen 2 11341
MediaTek Dimensity 8400 11315
Apple A16 Bionic 11022
MediaTek Dimensity 9200+ 11012
Samsung Exynos 2400e 10317
MediaTek Dimensity 9200 10289
Qualcomm Snapdragon 7+ Gen 3 10228

Specification

Processor nameMediaTek Dimensity 8400
Release Date12/20/2024
CPU Architecture1x 3.25GHz ARM Cortex-A725 + 3x 3.0GHz ARM Cortex-A725 + 4x 2.1GHz Cortex-A725
Number of Cores8
Clock Rate3.25 GHz
Chip technology4 nm
GPUARM Mali Immortalis G720 MC
The highest TDP10
Memory24 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)3000 Mbps