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MediaTek Helio G100 3DMark Benchmark score

MediaTek Helio G100 has an 3DMark benchmark score of around 1110 points, which ranks it above its competitors like the MediaTek Dimensity 700 (which received 1102 marks in this test). It was used for the Doogee S Cyber Pro and the Blackview BV8200 smartphones. The MediaTek Helio G100 is a powerful processor with great specs, that boasts 8 cores, 2.2 GHz clock rate, MaliG57MC GPU, and a 12 Gb memory support. The CPU is based on the 2x Cortex-A76 (2.2 GHz) + 6x Cortex-A55 (2 GHz) architecture, while the chip is made with 6 nm technology and has a TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Helio G100 3DMark Benchmark score
MediaTek Helio G100 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Helio G100?

CPU3DMark benchmark scores
MediaTek Dimensity 6080 1167
MediaTek Dimensity 6100+ 1132
MediaTek Dimensity 6020 1121
Qualcomm Snapdragon 750G 1121
Qualcomm Snapdragon 732G 1117
MediaTek Helio G100 1110
MediaTek Dimensity 700 1102
MediaTek Helio G99 1101
Qualcomm Snapdragon 7 Gen 4 1099
UNISOC T765 1099
MediaTek Helio G96 1084

Specification

Processor nameMediaTek Helio G100
Release Date08/07/2024
CPU Architecture2x Cortex-A76 (2.2 GHz) + 6x Cortex-A55 (2 GHz)
Number of Cores8
Clock Rate2.2 GHz
Chip technology6 nm
GPUMaliG57MC
The highest TDP
Memory12 Gb
FeaturesMediaTek modem
Upload Speed (up to)150 Mbps