Compare with:
Please enter model name or part of it
AED درهم BHD دب BRL R$ CNY ¥ CZK Kč DKK kr EUR € GBP £ IDR Rp ILS ₪ INR ₹ JPY ¥ KRW ₩ KWD د.ك NOK kr PLN zł QAR ريال RUB руб SAR SAR SEK kr TRY ₺ UAH грн
You were probably searching for:

MediaTek Dimensity 700 3DMark Benchmark score

MediaTek Dimensity 700 has an 3DMark benchmark score of around 1102 points, which ranks it above its competitors like the MediaTek Helio G99 (which received 1101 marks in this test). It was used for the Samsung Galaxy F42 5G and the UMIDIGI A13 Pro 5G smartphones. The MediaTek Dimensity 700 is a powerful processor with great specs, that boasts 8 cores, 2.2 GHz clock rate, Mali-G57MC GPU, and a 12 Gb memory support. The CPU is based on the 2x Cortex-A76 2,2 GHz + 6x Cortex-A55 2 GHz architecture, while the chip is made with 7 nm technology and has a 10 TDP. The built-in modem supports speeds up to 211 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 700 3DMark Benchmark score
MediaTek Dimensity 700 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 700?

CPU3DMark benchmark scores
MediaTek Dimensity 810 1228
Qualcomm Snapdragon 695 1211
MediaTek Dimensity 6020 1121
Qualcomm Snapdragon 750G 1121
Qualcomm Snapdragon 732G 1117
MediaTek Dimensity 700 1102
MediaTek Helio G99 1101
MediaTek Helio G96 1084
Qualcomm Snapdragon 835 1069
Qualcomm Snapdragon 690 1039
Qualcomm Snapdragon 480+ 989


Processor nameMediaTek Dimensity 700
Release Date11/10/2020
CPU Architecture2x Cortex-A76 2,2 GHz + 6x Cortex-A55 2 GHz
Number of Cores8
Clock Rate2.2 GHz
Chip technology7 nm
The highest TDP10
Memory12 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)211 Mbps