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MediaTek Helio G200 3DMark Benchmark score

MediaTek Helio G200 has an 3DMark benchmark score of around 1231 points, which ranks it above its competitors like the MediaTek Dimensity 810 (which received 1228 marks in this test). It was used for the Infinix Hot 60 Pro and the Infinix Hot 60 Pro smartphones. The MediaTek Helio G200 is a powerful processor with great specs, that boasts 8 cores, 2.2 GHz clock rate, MaliG57MC GPU, and a 12 Gb memory support. The CPU is based on the 2x Cortex-A76 (2.2 GHz) + 6x Cortex-A55 (2 GHz) architecture, while the chip is made with 6 nm technology and has a 7 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Helio G200 3DMark Benchmark score
MediaTek Helio G200 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Helio G200?

CPU3DMark benchmark scores
MediaTek Helio G95 1477
Qualcomm Snapdragon 845 1445
Huawei HiSilicon Kirin 810 1422
MediaTek Helio G90T 1318
MediaTek Dimensity 720 1242
MediaTek Helio G200 1231
MediaTek Dimensity 810 1228
Qualcomm Snapdragon 695 1211
MediaTek Dimensity 6300 1180
MediaTek Dimensity 6080 1167
MediaTek Dimensity 6100+ 1132

Specification

Processor nameMediaTek Helio G200
Release Date05/10/2025
CPU Architecture2x Cortex-A76 (2.2 GHz) + 6x Cortex-A55 (2 GHz)
Number of Cores8
Clock Rate2.2 GHz
Chip technology6 nm
GPUMaliG57MC
The highest TDP7
Memory12 Gb
FeaturesMediaTek modem
Upload Speed (up to)150 Mbps