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Qualcomm Snapdragon 845 3DMark Benchmark score

Qualcomm Snapdragon 845 has an 3DMark benchmark score of around 1445 points, which ranks it above its competitors like the Huawei HiSilicon Kirin 810 (which received 1422 marks in this test). It was used for the OnePlus 6T and the Meizu 16th 6/128Gb smartphones. The Qualcomm Snapdragon 845 is a powerful processor with great specs, that boasts 8 cores, 2.8 GHz clock rate, Adreno 630 GPU, and a 8 Gb memory support. The CPU is based on the 4x 2.8GHz Cortex-A75 + 4x 1.5GHz Cortex-A55 architecture, while the chip is made with 10 nm technology and has a 9 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 845 3DMark Benchmark score
Qualcomm Snapdragon 845 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 845?

CPU3DMark benchmark scores
Samsung Exynos 1330 1702
Qualcomm Snapdragon 765 1669
Apple A9 Twister 1659
MediaTek Dimensity 800U 1602
MediaTek Helio G95 1477
Qualcomm Snapdragon 845 1445
Huawei HiSilicon Kirin 810 1422
MediaTek Helio G90T 1318
MediaTek Dimensity 720 1242
MediaTek Dimensity 810 1228
Qualcomm Snapdragon 695 1211

Specification

Processor nameQualcomm Snapdragon 845
Release Date02/12/2018
CPU Architecture4x 2.8GHz Cortex-A75 + 4x 1.5GHz Cortex-A55
Number of Cores8
Clock Rate2.8 GHz
Chip technology10 nm
GPUAdreno 630
The highest TDP9
Memory8 Gb
FeaturesSnapdragon X20
Upload Speed (up to)150 Mbps