Huawei HiSilicon Kirin 810 3DMark Benchmark score
Huawei HiSilicon Kirin 810 has an 3DMark benchmark score of around 1422 points, which ranks it above its competitors like the MediaTek Helio G90T (which received 1318 marks in this test). It was used for the Huawei Honor 9X Pro and the Huawei Nova 5 smartphones. The Huawei HiSilicon Kirin 810 is a powerful processor with great specs, that boasts 8 cores, 2.27 GHz clock rate, Mali-G52MP GPU, and a 8 Gb memory support. The CPU is based on the 2 x 2.27 GHz ARM Cortex-A76 + 6 x 1.88 GHz ARM Cortex-A55 architecture, while the chip is made with 7 nm technology and has a 5 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 810?
Specification
| Processor name | Huawei HiSilicon Kirin 810 |
|---|---|
| Release Date | 6/21/2019 |
| CPU Architecture | 2 x 2.27 GHz ARM Cortex-A76 + 6 x 1.88 GHz ARM Cortex-A55 |
| Number of Cores | 8 |
| Clock Rate | 2.27 GHz |
| Chip technology | 7 nm |
| GPU | Mali-G52MP |
| The highest TDP | 5 |
| Memory | 8 Gb |
| Features | Huawei HiSilicon modem |
| Upload Speed (up to) | 150 Mbps |