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MediaTek Dimensity 810 3DMark Benchmark score

MediaTek Dimensity 810 has an 3DMark benchmark score of around 1228 points, which ranks it above its competitors like the Qualcomm Snapdragon 695 (which received 1211 marks in this test). It was used for the Realme 8s and the Honor Play 6T Pro smartphones. The MediaTek Dimensity 810 is a powerful processor with great specs, that boasts 8 cores, 2.4 GHz clock rate, Mali-G57MP GPU, and a 16 Gb memory support. The CPU is based on the 4x Cortex-A76 (2.4 GHz) + 4x Cortex-A55 (2 GHz) architecture, while the chip is made with 7 nm technology and has a 8 TDP. The built-in modem supports speeds up to 200 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 810 3DMark Benchmark score
MediaTek Dimensity 810 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 810?

CPU3DMark benchmark scores
MediaTek Helio G95 1477
Qualcomm Snapdragon 845 1445
Huawei HiSilicon Kirin 810 1422
MediaTek Helio G90T 1318
MediaTek Dimensity 720 1242
MediaTek Dimensity 810 1228
Qualcomm Snapdragon 695 1211
MediaTek Dimensity 6080 1167
MediaTek Dimensity 6100+ 1132
MediaTek Dimensity 6020 1121
Qualcomm Snapdragon 750G 1121

Specification

Processor nameMediaTek Dimensity 810
Release Date8/10/2021
CPU Architecture4x Cortex-A76 (2.4 GHz) + 4x Cortex-A55 (2 GHz)
Number of Cores8
Clock Rate2.4 GHz
Chip technology7 nm
GPUMali-G57MP
The highest TDP8
Memory16 Gb
FeaturesMediaTek 5G modem
Upload Speed (up to)200 Mbps