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MediaTek Dimensity 8200 3DMark Benchmark score

MediaTek Dimensity 8200 has an 3DMark benchmark score of around 6188 points, which ranks it above its competitors like the MediaTek Dimensity 8000 (which received 6107 marks in this test). It was used for the Vivo V30 Pro and the Oppo Reno10 Pro smartphones. The MediaTek Dimensity 8200 is a powerful processor with great specs, that boasts 8 cores, 3.1 GHz clock rate, Mali-G610 MC GPU, and a 16 Gb memory support. The CPU is based on the 1x Cortex-A710 3.1Ghz + 1x Cortex-A710 3.0Ghz + 4x Cortex-A510 2Ghz architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 500 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 8200 3DMark Benchmark score
MediaTek Dimensity 8200 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 8200?

CPU3DMark benchmark scores
MediaTek Dimensity 8250 6311
Qualcomm Snapdragon 7 Gen 3 6255
Google Tensor 6220
MediaTek Dimensity 8100 6213
HiSilicon Kirin 9000s 6211
MediaTek Dimensity 8200 6188
MediaTek Dimensity 8000 6107
Huawei HiSilicon Kirin 9000 6041
Huawei HiSilicon Kirin 9000E 5655
Qualcomm Snapdragon 888 Plus 5622
Samsung Exynos 1080 5587

Specification

Processor nameMediaTek Dimensity 8200
Release Date11/20/2024
CPU Architecture1x Cortex-A710 3.1Ghz + 1x Cortex-A710 3.0Ghz + 4x Cortex-A510 2Ghz
Number of Cores8
Clock Rate3.1 GHz
Chip technology4 nm
GPUMali-G610 MC
The highest TDP10
Memory16 Gb
FeaturesMediaTek Custom Integrated 5G modem
Upload Speed (up to)500 Mbps