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Qualcomm Snapdragon 855 Plus 3DMark Benchmark score

Qualcomm Snapdragon 855 Plus has an 3DMark benchmark score of around 2368 points, which ranks it above its competitors like the MediaTek Dimensity 820 (which received 2344 marks in this test). It was used for the Vivo NEX 3 and the Xiaomi Mi 9 Pro 5G 8 256Gb smartphones. The Qualcomm Snapdragon 855 Plus is a powerful processor with great specs, that boasts 8 cores, 2.96 GHz clock rate, Adreno 640 GPU, and a 16 Gb memory support. The CPU is based on the 1x 2.96 ГГц Cortex-A76 + 3x 2.42 ГГц Cortex-A76 + 4x 1.8 GHz Cortex-A55 architecture, while the chip is made with 7 nm technology and has a 10 TDP. The built-in modem supports speeds up to 316 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 855 Plus 3DMark Benchmark score
Qualcomm Snapdragon 855 Plus 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 855 Plus?

CPU3DMark benchmark scores
Huawei HiSilicon Kirin 980 2486
Qualcomm Snapdragon 778G 2465
MediaTek Dimensity 7050 2432
MediaTek Dimensity 1080 2411
Qualcomm Snapdragon 4 Gen 2 2389
Qualcomm Snapdragon 855 Plus 2368
MediaTek Dimensity 820 2344
Samsung Exynos 9810 2343
MediaTek Dimensity 920 2296
Huawei HiSilicon Kirin 985 5G 2289
Samsung Exynos 1380 2235

Specification

Processor nameQualcomm Snapdragon 855 Plus
Release Date7/15/2019
CPU Architecture1x 2.96 ГГц Cortex-A76 + 3x 2.42 ГГц Cortex-A76 + 4x 1.8 GHz Cortex-A55
Number of Cores8
Clock Rate2.96 GHz
Chip technology7 nm
GPUAdreno 640
The highest TDP10
Memory16 Gb
FeaturesSnapdragon X24
Upload Speed (up to)316 Mbps