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HiSilicon Kirin 9030 3DMark Benchmark score

HiSilicon Kirin 9030 has an 3DMark benchmark score of around 6511 points, which ranks it above its competitors like the HiSilicon Kirin 9010 (which received 6453 marks in this test). It was used for the Huawei Mate 80 Pro and the Huawei Mate 80 Pro smartphones. The HiSilicon Kirin 9030 is a powerful processor with great specs, that boasts 8 cores, 2.75 GHz clock rate, Maleoon 935 GPU, and a 24 Gb memory support. The CPU is based on the 1xTaishan 2.75 GHz + 4x2.27 GHz + 4x1.72 GHz architecture, while the chip is made with 6 nm technology and has a 10 TDP. The built-in modem supports speeds up to 3000 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

HiSilicon Kirin 9030 3DMark Benchmark score
HiSilicon Kirin 9030 3DMark Benchmark score

What is the 3DMark Benchmark score of HiSilicon Kirin 9030?

CPU3DMark benchmark scores
Apple A13 Bionic 7578
MediaTek Dimensity 8300 7076
Samsung Exynos 2200 6902
HiSilicon Kirin 9020 6893
Google Tensor G3 6657
HiSilicon Kirin 9030 6511
HiSilicon Kirin 9010 6453
Google Tensor G2 6398
MediaTek Dimensity 8250 6311
Qualcomm Snapdragon 7 Gen 3 6255
Google Tensor 6220

Specification

Processor nameHiSilicon Kirin 9030
Release Date11/01/2025
CPU Architecture1xTaishan 2.75 GHz + 4x2.27 GHz + 4x1.72 GHz
Number of Cores8
Clock Rate2.75 GHz
Chip technology6 nm
GPUMaleoon 935
The highest TDP10
Memory24 Gb
FeaturesKirin 5G modem
Upload Speed (up to)3000 Mbps