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Huawei HiSilicon Kirin 710 3DMark Benchmark score

Huawei HiSilicon Kirin 710 has an 3DMark benchmark score of around 544 points, which ranks it above its competitors like the Qualcomm Snapdragon 678 (which received 483 marks in this test). It was used for the Huawei Honor 10 Lite 3/64Gb 1 and the Huawei Honor 20 Lite smartphones. The Huawei HiSilicon Kirin 710 is a powerful processor with great specs, that boasts 8 cores, 2.2 GHz clock rate, Mali-G51 MP GPU, and a 6 Gb memory support. The CPU is based on the 4 x 2.2 GHz ARM Cortex-A73 + 4 x 1.7 GHz ARM Cortex-A53 architecture, while the chip is made with 12 nm technology and has a 5 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Huawei HiSilicon Kirin 710 3DMark Benchmark score
Huawei HiSilicon Kirin 710 3DMark Benchmark score

What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 710?

CPU3DMark benchmark scores
UNISOC Tiger T700 561
Samsung Exynos 9609 554
MediaTek Helio P95 548
Qualcomm Snapdragon 710 547
UNISOC Tiger T610 547
Huawei HiSilicon Kirin 710 544
Qualcomm Snapdragon 678 483
MediaTek Helio P90 467
Qualcomm Snapdragon 685 465
UNISOC Tiger T619 463
UNISOC Tiger T616 457

Specification

Processor nameHuawei HiSilicon Kirin 710
Release Date7/19/2018
CPU Architecture4 x 2.2 GHz ARM Cortex-A73 + 4 x 1.7 GHz ARM Cortex-A53
Number of Cores8
Clock Rate2.2 GHz
Chip technology12 nm
GPUMali-G51 MP
The highest TDP5
Memory6 Gb
FeaturesHuawei HiSilicon modem
Upload Speed (up to)150 Mbps