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Qualcomm Snapdragon 821 3DMark Benchmark score

Qualcomm Snapdragon 821 has an 3DMark benchmark score of around 745 points, which ranks it above its competitors like the MediaTek Helio P70 (which received 722 marks in this test). It was used for the Xiaomi Mi5S Plus 128 and the LeEco Le Pro 3 64 smartphones. The Qualcomm Snapdragon 821 is a powerful processor with great specs, that boasts 4 cores, 2.34 GHz clock rate, Adreno 530 GPU, and a 6 Gb memory support. The CPU is based on the 2 x Kryo 2,34 GHz + 2 x Kryo 1,6 GHz architecture, while the chip is made with 14 nm technology and has a 11 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 821 3DMark Benchmark score
Qualcomm Snapdragon 821 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 821?

CPU3DMark benchmark scores
Samsung Exynos 8895 872
Huawei HiSilicon Kirin 970 834
Qualcomm Snapdragon 720G 783
Samsung Exynos 9611 778
Qualcomm Snapdragon 730G 748
Qualcomm Snapdragon 821 745
MediaTek Helio P70 722
MediaTek Helio G88 719
MediaTek Helio G85 714
Qualcomm Snapdragon 820 711
Qualcomm Snapdragon 670 691

Specification

Processor nameQualcomm Snapdragon 821
Release Date8/16/2016
CPU Architecture2 x Kryo 2,34 GHz + 2 x Kryo 1,6 GHz
Number of Cores4
Clock Rate2.34 GHz
Chip technology14 nm
GPUAdreno 530
The highest TDP11
Memory6 Gb
FeaturesSnapdragon X12
Upload Speed (up to)150 Mbps