Qualcomm Snapdragon 821 3DMark Benchmark score
Qualcomm Snapdragon 821 has an 3DMark benchmark score of around 745 points, which ranks it above its competitors like the MediaTek Helio P70 (which received 722 marks in this test). It was used for the Xiaomi Mi5S Plus 128 and the LeEco Le Pro 3 64 smartphones. The Qualcomm Snapdragon 821 is a powerful processor with great specs, that boasts 4 cores, 2.34 GHz clock rate, Adreno 530 GPU, and a 6 Gb memory support. The CPU is based on the 2 x Kryo 2,34 GHz + 2 x Kryo 1,6 GHz architecture, while the chip is made with 14 nm technology and has a 11 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Qualcomm Snapdragon 821?
Specification
Processor name | Qualcomm Snapdragon 821 |
---|---|
Release Date | 8/16/2016 |
CPU Architecture | 2 x Kryo 2,34 GHz + 2 x Kryo 1,6 GHz |
Number of Cores | 4 |
Clock Rate | 2.34 GHz |
Chip technology | 14 nm |
GPU | Adreno 530 |
The highest TDP | 11 |
Memory | 6 Gb |
Features | Snapdragon X12 |
Upload Speed (up to) | 150 Mbps |