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Qualcomm Snapdragon 670 3DMark Benchmark score

Qualcomm Snapdragon 670 has an 3DMark benchmark score of around 691 points, which ranks it above its competitors like the MediaTek Helio G80 (which received 684 marks in this test). It was used for the Oppo R17 and the Google Pixel 3a smartphones. The Qualcomm Snapdragon 670 is a powerful processor with great specs, that boasts 8 cores, 2 GHz clock rate, Adreno 615 GPU, and a 8 Gb memory support. The CPU is based on the 2 x 2 GHz Cortex-A75 Kryo 360 + 6 x 1.7 GHz Cortex-A55 Kryo 360 architecture, while the chip is made with 10 nm technology and has a 9 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 670 3DMark Benchmark score
Qualcomm Snapdragon 670 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 670?

CPU3DMark benchmark scores
Qualcomm Snapdragon 821 745
MediaTek Helio P70 722
MediaTek Helio G88 719
MediaTek Helio G85 714
Qualcomm Snapdragon 820 711
Qualcomm Snapdragon 670 691
MediaTek Helio G80 684
Qualcomm Snapdragon 730 668
Samsung Exynos 8890 658
Qualcomm Snapdragon 712 655
MediaTek Helio G91 607

Specification

Processor nameQualcomm Snapdragon 670
Release Date8/8/2018
CPU Architecture2 x 2 GHz Cortex-A75 Kryo 360 + 6 x 1.7 GHz Cortex-A55 Kryo 360
Number of Cores8
Clock Rate2 GHz
Chip technology10 nm
GPUAdreno 615
The highest TDP9
Memory8 Gb
FeaturesSnapdragon X12
Upload Speed (up to)150 Mbps