HiSilicon Kirin 8000 3DMark Benchmark score
HiSilicon Kirin 8000 has an 3DMark benchmark score of around 2447 points, which ranks it above its competitors like the Qualcomm Snapdragon 4 Gen 2 AE (which received 2441 marks in this test). It was used for the Huawei Nova 14 and the Huawei Nova 13 smartphones. The HiSilicon Kirin 8000 is a powerful processor with great specs, that boasts 8 cores, 2.4 GHz clock rate, Mali-G610 GPU, and a 16 Gb memory support. The CPU is based on the 1 x Cortex-A77 2.4Ghz + 3 x Cortex-A77 2.19Ghz + 4 x Cortex-A55 1.84Ghz architecture, while the chip is made with 7 nm technology and has a 8 TDP. The built-in modem supports speeds up to 400 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of HiSilicon Kirin 8000?
Specification
| Processor name | HiSilicon Kirin 8000 |
|---|---|
| Release Date | 12/12/2023 |
| CPU Architecture | 1 x Cortex-A77 2.4Ghz + 3 x Cortex-A77 2.19Ghz + 4 x Cortex-A55 1.84Ghz |
| Number of Cores | 8 |
| Clock Rate | 2.4 GHz |
| Chip technology | 7 nm |
| GPU | Mali-G610 |
| The highest TDP | 8 |
| Memory | 16 Gb |
| Features | Kirin 5G modem |
| Upload Speed (up to) | 400 Mbps |