Qualcomm Snapdragon 778G+ 3DMark Benchmark score
Qualcomm Snapdragon 778G+ has an 3DMark benchmark score of around 2490 points, which ranks it above its competitors like the MediaTek Dimensity 930 (which received 2487 marks in this test). It was used for the Honor 70 12 512Gb and the Honor 60 Pro 12 256Gb smartphones. The Qualcomm Snapdragon 778G+ is a powerful processor with great specs, that boasts 8 cores, 2.5 GHz clock rate, Adreno 642L GPU, and a 16 Gb memory support. The CPU is based on the 1 x Cortex-A78 2.5Ghz + 3 x Cortex-A78 2.2Ghz + 4 x Cortex-A55 1.9Ghz architecture, while the chip is made with 6 nm technology and has a 5 TDP. The built-in modem supports speeds up to 210 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Qualcomm Snapdragon 778G+?
Specification
Processor name | Qualcomm Snapdragon 778G+ |
---|---|
Release Date | 10/10/2021 |
CPU Architecture | 1 x Cortex-A78 2.5Ghz + 3 x Cortex-A78 2.2Ghz + 4 x Cortex-A55 1.9Ghz |
Number of Cores | 8 |
Clock Rate | 2.5 GHz |
Chip technology | 6 nm |
GPU | Adreno 642L |
The highest TDP | 5 |
Memory | 16 Gb |
Features | Snapdragon X53 |
Upload Speed (up to) | 210 Mbps |