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Qualcomm Snapdragon 778G+ 3DMark Benchmark score

Qualcomm Snapdragon 778G+ has an 3DMark benchmark score of around 2490 points, which ranks it above its competitors like the MediaTek Dimensity 930 (which received 2487 marks in this test). It was used for the Honor 70 12 512Gb and the Honor 60 Pro 12 256Gb smartphones. The Qualcomm Snapdragon 778G+ is a powerful processor with great specs, that boasts 8 cores, 2.5 GHz clock rate, Adreno 642L GPU, and a 16 Gb memory support. The CPU is based on the 1 x Cortex-A78 2.5Ghz + 3 x Cortex-A78 2.2Ghz + 4 x Cortex-A55 1.9Ghz architecture, while the chip is made with 6 nm technology and has a 5 TDP. The built-in modem supports speeds up to 210 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 778G+ 3DMark Benchmark score
Qualcomm Snapdragon 778G+ 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 778G+?

CPU3DMark benchmark scores
MediaTek Dimensity 7030 2855
Qualcomm Snapdragon 855 2755
Qualcomm Snapdragon 7s Gen 2 2677
Apple A10 Fusion 2591
Qualcomm Snapdragon 782G 2557
Qualcomm Snapdragon 778G+ 2490
MediaTek Dimensity 930 2487
Huawei HiSilicon Kirin 980 2486
Qualcomm Snapdragon 778G 2465
MediaTek Dimensity 7050 2432
MediaTek Dimensity 1080 2411

Specification

Processor nameQualcomm Snapdragon 778G+
Release Date10/10/2021
CPU Architecture1 x Cortex-A78 2.5Ghz + 3 x Cortex-A78 2.2Ghz + 4 x Cortex-A55 1.9Ghz
Number of Cores8
Clock Rate2.5 GHz
Chip technology6 nm
GPUAdreno 642L
The highest TDP5
Memory16 Gb
FeaturesSnapdragon X53
Upload Speed (up to)210 Mbps