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Huawei HiSilicon Kirin 980 3DMark Benchmark score

Huawei HiSilicon Kirin 980 has an 3DMark benchmark score of around 2486 points, which ranks it above its competitors like the Qualcomm Snapdragon 778G (which received 2465 marks in this test). It was used for the Huawei P30 and the Huawei P30 Pro smartphones. The Huawei HiSilicon Kirin 980 is a powerful processor with great specs, that boasts 8 cores, 2.6 GHz clock rate, Mali G76MP GPU, and a 8 Gb memory support. The CPU is based on the 2 x 2.6 GHz ARM Cortex-A76 + 2 x 1.92 GHz ARM Cortex-A76 + 4 x 1.8 GHz ARM Cortex-A55 architecture, while the chip is made with 7 nm technology and has a 6 TDP. The built-in modem supports speeds up to 200 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Huawei HiSilicon Kirin 980 3DMark Benchmark score
Huawei HiSilicon Kirin 980 3DMark Benchmark score

What is the 3DMark Benchmark score of Huawei HiSilicon Kirin 980?

CPU3DMark benchmark scores
Qualcomm Snapdragon 7s Gen 2 2677
Apple A10 Fusion 2591
Qualcomm Snapdragon 782G 2557
Qualcomm Snapdragon 778G+ 2490
MediaTek Dimensity 930 2487
Huawei HiSilicon Kirin 980 2486
Qualcomm Snapdragon 778G 2465
MediaTek Dimensity 7050 2432
MediaTek Dimensity 1080 2411
Qualcomm Snapdragon 4 Gen 2 2389
Qualcomm Snapdragon 855 Plus 2368

Specification

Processor nameHuawei HiSilicon Kirin 980
Release Date8/31/2018
CPU Architecture2 x 2.6 GHz ARM Cortex-A76 + 2 x 1.92 GHz ARM Cortex-A76 + 4 x 1.8 GHz ARM Cortex-A55
Number of Cores8
Clock Rate2.6 GHz
Chip technology7 nm
GPUMali G76MP
The highest TDP6
Memory8 Gb
FeaturesHuawei HiSilicon modem
Upload Speed (up to)200 Mbps