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MediaTek Dimensity 7050 3DMark Benchmark score

MediaTek Dimensity 7050 has an 3DMark benchmark score of around 2432 points, which ranks it above its competitors like the MediaTek Dimensity 1080 (which received 2411 marks in this test). It was used for the Ulefone Power Armor 18 Ultra 5G and the Realme 11 Pro Plus smartphones. The MediaTek Dimensity 7050 is a powerful processor with great specs, that boasts 8 cores, 2.6 GHz clock rate, Arm Mali-G68 MC GPU, and a 16 Gb memory support. The CPU is based on the 2x Cortex-A78 2.6 GHz + 6x Cortex-A55 2 GHz architecture, while the chip is made with 6 nm technology and has a 10 TDP. The built-in modem supports speeds up to 300 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 7050 3DMark Benchmark score
MediaTek Dimensity 7050 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 7050?

CPU3DMark benchmark scores
Qualcomm Snapdragon 782G 2557
Qualcomm Snapdragon 778G+ 2490
MediaTek Dimensity 930 2487
Huawei HiSilicon Kirin 980 2486
Qualcomm Snapdragon 778G 2465
MediaTek Dimensity 7050 2432
MediaTek Dimensity 1080 2411
Qualcomm Snapdragon 4 Gen 2 2389
Qualcomm Snapdragon 855 Plus 2368
MediaTek Dimensity 820 2344
Samsung Exynos 9810 2343

Specification

Processor nameMediaTek Dimensity 7050
Release Date05/02/2023
CPU Architecture2x Cortex-A78 2.6 GHz + 6x Cortex-A55 2 GHz
Number of Cores8
Clock Rate2.6 GHz
Chip technology6 nm
GPUArm Mali-G68 MC
The highest TDP10
Memory16 Gb
FeaturesMediatek 5G modem
Upload Speed (up to)300 Mbps